R560 Solder Paste
Kester R560 is an organic acid, water-soluble solder paste formula specifically designed to reduce voiding in Ball Grid Array (BGA) solder connections. The voiding in BGA's has been shown to be reduced from 25% to less than 5%. R560 is also resistant to extremes in temperature and relative humidity. R560 is designed to be slump resistant in high humidity conditions. The solder paste exhibits long stencil life and tack time, while still delivering exceptional solderability to a wide variety of metallic substrates. The activator package in this formula is very aggressive, providing superior wetting to OSP coated boards and Ag/Pd leaded components.