SMTA International
Rosemont, IL
Booth 117
October 16-17, 2018
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Speaker Schedule
Monday, October 15 at 3:30PM
"Reducing Spatter in Flux Cored Solder Wires for Robotic Soldering Applications"
Chad Showalter, Arturo Espejo, Olga Spaldon-Stewart, Kyle Loomis, Kester
Tuesday, October 16 at 2:00PM
"Rheology of Flux and Solder Paste II: Shelf Life Study"
Fan Gao, Ph.D., Dinesh Amin, Jennifer Allen, Kyle Loomis, Kester
Wednesday, October 17 at 8:30AM
"Selective Soldering Design for Reliability Using a Novel Test Board and SIR Test Method"
*Mike Bixenman, DBA, KYZEN Corporation; *Mark McMeen, STI Electronics; *Denis Jean, Kester; Joe Clure, Kurtz Ersa
Wednesday, October 17 at 2:00PM
"Void Reduction in Reflow Soldering Processes by Sweep Stimulation of PCB Substrate – DoE Tests"
*Viktoria Rawinski, Joe Clure, ERSA; Denis Jean, Kester; Marcel Buck, ERSA
Capital Expo & Tech Forum
John Hopkins Applied Physics Lab - Laurel, MD
August 23, 2018
PSECE 2018 - Philippine Semiconductor & Electronics Convention and Exhibition
SMX Convention Centre - Manila, Philippines
June 13-15, 2018
SNEC 12th (2018) International Photovoltaic Power Generation and Smart Energy Exhibition & Conference
Kerry Hotel - Pudong, Shanghai
Booth E3 610
May 27-30, 2018
Speaker Schedule
Fan Gao, May 29, 11:45 AM
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SMTA Atlanta - 22nd Annual Expo
Wednesday, April 18, 2018
Location: Infinite Energy Center - Duluth, GA
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Nepcon China
Shanghai, China
Booth 1H40
April 24-26, 2018
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SEMICON China
Shanghai New International Expo Centre - Shanghai, China
Hall N1, Booth 1611
March 14-16,2018
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IPC APEX EXPO 2018
San Diego Convention Center - San Diego, CA
Booth 3118
February 27-March 1, 2018
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Productronica
Munich, Germany
Booth 554 (Hall A4)
November 14-17, 2017
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SMTA Guadalajara 2017 Tech Forum & Expo
Guadalajara, Mexico
October 18-19, 2017
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NEPCON Vietnam 2017
Hanoi, Vietnam
Booth F11
September 13-15, 2017
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SEMICON Taiwan
Taipei, Taiwan
September 13-15, 2017
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SMTA International
Rosemont, IL
Booth 1123
September 19-20, 2017
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Speaker Schedule: Tuesday, September 19
Fan Gao, Ph.D., 11AM
"Rheology Behavior of Flux and Solder Paste"
Speaker Schedule: Wednesday, September 20
Hemal Bhavsar, 8:30AM
"Device Assembly Considerations for Integration of One-Step Chip Attach Materials in Conventional Reflow Processing"
Bruno Tolla, Ph.D. and Mike Bixenman, DBA (Kyzen Corporation), 11AM
"Dendritic Growth from Chemical Contamination and Partial Cleaning: Fundamental Tests and Application Study"
14th Philippine Semiconductor & Electronics Convention and Exhibition (PSECE 2017)
Manila, Philippines
Booth 349 & 366
June 21-23, 2017
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Contamination, Cleaning and Coating Conference
Radisson Blu Hotel Amsterdam Airport Schiphol - Amsterdam, Netherlands
May 23-24, 2017
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Speaker Schedule
Bruno Tolla,Tuesday, May 23
"Impact of reflow and cleaning conditions on the electrochemical activity of flux residues under surface mount components"
Technical Rework Seminar
Kester's Global Headquarters - Itasca, IL
May 10, 2017
Click here to RSVP.
SMT Hybrid Packaging 2017
Nuremberg, Germany
Booth 4-533
May 16-18, 2017
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SMTA China East/NEPCON China
Shanghai World Expo Exhibition & Convention Center - Shanghai, China
Booth #: 1H43
April 25-27, 2017
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Speaker Schedule
Yanrong Shi, Tuesday, April 25, 2:55pm
"Development of a Risk Profile from Flux Residues Trapped under Leadless Components"
SNEC 2017
Shanghai, China
April 18-20, 2017
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Speaker Schedule
Yanrong Shi, Thursday April 20 at 3:00pm
"Insights of solder flux fundamentals in solar module assembly"
Atlanta 21st Annual Expo
Wednesday, April 19, 2017
Location: Infinite Energy Center (Formerly Gwinnett Center) - 6400 Sugarloaf Parkway, Duluth, GA 30097
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SMTA South East Asia Technical Conference on Electronics Assembly
Olive Tree Hill - Penang, Malaysia
March 28-30, 2017
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Speaker Schedule
Bruno Tolla and Mike Bixenman (Kyzen), Wednesday, March 29, 10:30am
"Development of a Risk Profile from Flux Residues Trapped under Leadless Components"
SMTA Space Coast Chapter Panel Discussion
Topic: "Avoiding the Voids in Reflow Soldering"
Wednesday, March 15, 2017
Location: Mack Technologies in Melbourne, FL.
Click here to RSVP or for any questions
Speaker Schedule
Mike Kaminsky, Senior Field Applications Support Engineer will be part of the panel discussion
SMTA Houston Expo & Tech Forum
Thursday, March 9, 2017
Location: Stafford Centre - 10505 Cash Road, Stafford, TX 77477
Booth #64
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SMTA Dallas Expo & Tech Forum
Tuesday, March 7, 2017
Location: Plano Centre - 2000 E. Spring Creek Pkwy, Plano, TX 75074
Booth #416
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IPC APEX EXPO 2017
San Diego Convention Center - San Diego, CA
Booth 2205
February 14-16, 2017
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Speaker Schedule
Mike Bixenman (Kyzen) and Bruno Tolla, February 14, 1:30pm
"Electrochemical Methods to Measure the Corrosion Potential of Flux Residues"
Rocky Mountain Expo & Tech Forum
West Club at Mile High Stadium - Denver, CO
January 19, 2017
Kurtz Ersa Soldering Seminar & Grand Opening
Demo & Technology Center - Jalisco, Mexico
Technical Seminars: November 15th and 16th and Opening: November 17th
Speaker Schedule
Denis Jean, November 15 & 16, 9:30 AM
"How to formulate the right flux for the selective soldering application"
MATELEC 2016
Ifema - Feria de Madrid – Madrid, Spain
October 25-28, 2016
SMTA-IPC High-Reliability Cleaning and Conformal Coating Conference
Hyatt Rosemont - Rosemont, IL
October 25-27, 2016
Speaker Schedule
Bruno Tolla, October 26, 9:45 AM
“No-Clean Flux Activity under Bottom Terminations”
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Taiwan International Photovoltaic Exhibition
Taipei Nangang Exhibition Center - Taiwan
Booth # K0408
October 12-14, 2016
“QFN: Design - Cleaning - Reliability: What you can't see can cause failure!” Webinar
Thursday, October 13, 2016 10:00AM - 11:00AM CDT
Speaker Schedule
Bruno Tolla will be a panelist during this free webinar.
To learn more information and to register for the webinar, please click here.
SMTA International
Donald Stephens Convention Center – Rosemont, IL
Booth 500
September 27 – 28, 2016
Speaker Schedule, September 27
Paul Groome (Digitaltest), and Kester's Denis Jean and Bruno Tolla, September 27, 11:30AM
Breaking Through Flux Residues to Provide Reliable Probing on PCBAs
Bruno Tolla, 2-2:30pm
Surface Insulation Resistance of No-clean Flux Residues Under Various Surface Mount Components
Mike Bixenman (Kyzen) and Bruno Tolla, 3-3:30pm
Reactivity of No-Clean Flux Residues Trapped Under Bottom Terminated Components Can Cause Leakage Currents to Form
Hemal Bhavsar, 3-3:30pm
Improved Reliability Performance of Jet Dispensable Polymeric Coating Material
Speaker Schedule, Wednesday, September 28
Chad Showalter, 3-3:30pm
A Study of Overcoming Solder Icicling and Copper Wire Dissolution in an Automated Lead-Free Soldering System
SMTA Guadalajara Expo Forum 2016
Hotel RIU Guadalajara
Booth 39
October 4 – 5, 2016
2016 SNEC International Photovoltaic Power Generation Conference & Exhibition
Kerry Hotel Pudong, Shanghai
Booth E3 – 375
May 23-25, 2016
2016 Carolinas Expo & Tech Conference
Holiday Inn Greensboro Airport, Greensboro, NC
Booth 20
May 24, 2016
NEPCON China 2016
Shanghai World EXPO Exhibition & Convention Center
Booth 1G40, Hall 1
April 26-28, 2016
Speaker Schedule
Yanrong Shi, Chemist, April 27, 10:30AM
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SMT Hybrid Packaging 2016
Exhibition Centre, Nuremberg, Germany
April 26-28, 2016
SMTA Atlanta 20th Annual Expo
Infinite Energy Center (formerly Gwinnett Center), Duluth, GA
April 20, 2016
Anglo Production Processes Ltd.’s. Technology Days
APP's UK Headquarters, Bromsgrove, Worcestershire, England
April 20-21, 2016
SMTA Dallas
Plano Centre, Plano, TX
Booth 416
March 3, 2016
Speaker Schedule
Bruno Tolla, Global R&D Director, March 3, 1:30 PM
Impact of Flux Residues on the Reliability of Electronic Assemblies
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IPC APEX EXPO 2016
Las Vegas Convention Center, Las Vegas, NV
Booth 757
March 15-17, 2016
Speaker Schedule
Denis Jean, Technical Support, March 15, 3:30 PM
How to Choose the Right Flux for the Selective Soldering Application
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PCB Carolina 2015
McKimmon Center, NCSU, Raleigh, NC
Table #11
November 4, 2015
Productronica
Messe München International, Munich, Germany
Booth A4.554
November 10-13, 2015
48th International Symposium on Microelectronics - IMAPS
Rosen Centre Hotel, Orlando, FL
October 27-29, 2015
Speaker Schedule
Dan Duffy, Research Scientist, October 29, 2:30 PM
Design of Filled One Step Chip Attach Materials (OSCA) for Conventional Mass Reflow Processing: Rheology Considerations for Jet Dispensing and Die Placement
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12th Annual International Wafer-Level Packaging Conference and Tabletop Exhibition
DoubleTree San Jose Airport Hotel, San Jose, CA
October 13-15, 2015
Speaker Schedule
Dan Duffy, Research Scientist, October 14, 10:45 AM
Assemblies Containing Copper Pillar Structures Processed Using One Step Chip Attach Materials (OSCA) and Conventional Mass Reflow Processing
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SMTA Guadalajara 2015
Hotel Riu Plaza Guadalajara, Guadalajara, Mexico
October 14-15, 2015
SMTA International 2015
Donald Stephens Convention Center Rosemont, IL
Booth 131
September 27-October 1, 2015
Speaker Schedule
Xiang (Shawn) Wei, Ph.D., September 29, 2:00 PM
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Bruno Tolla, Global R&D Director, October 1, 10:30 AM
Reactivity of No-Clean Flux Residues in Electronic Assemblies: A Systematic Study
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NEPCON South China
Shenzhen Convention and Exhibition Centre
August 25-27, 2015
ECTC
Sheraton San Diego Hotel & Marina
May 26-29, 2015
Speaker Schedule
Dan Duffy, Research Scientist, May 25, 11:15 AM
Rheology Design Considerations for One Chip Attach Materials (OSCA) Used for Conventional Mass Reflow Processing
NEPCON China
Shanghai World Expo Convention Center
April 21-23, 2015
Speaker Schedule
Bruno Tolla, Global R&D Director, April 15, 10:30 AM
Chemical Influences on the Reliability of Complex Assemblies