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R520A Solder Paste

R520A Solder Paste

Kester R520A is a lead-free, organic acid, water-soluble solder paste formula specifically designed for use with the higher temperature Pb-Free alternative soldering alloys such as Sn96.5Ag3.0Cu0.5 (SAC Alloys). The solder paste exhibits long stencil life and tack time, while still delivering exceptional solderability to a wide variety of metallic substrates. R520A was formulated to release consistently from the stencil for those critical fine pitch applications (0.5 mm/20 mils) with anti-slump characteristics and preferred solder deposit definition. The activator package in this formula is extremely aggressive, providing superior wetting to OSP coated and Immersion Gold over Electroless Nickel (ENIG) boards. R520A is an extremely stable water-soluble formula. Share Find A Distributor To Buy
Alloy Powder Size Type Halogen Content Lead Content Description Part # Process
Sn96.5Ag3.0Cu0.5 3 Water-Soluble Contains Halogen Lead-Free R520A Sn96.5Ag3.0Cu0.5 T3 89.5% 500g JAR 7019030810 Screen/Stencil Printing
Sn96.5Ag3.0Cu0.5 3 Water-Soluble Contains Halogen Lead-Free R520A Sn96.5Ag3.0Cu0.5 T3 89.5% 600g CRT 7019030811 Screen/Stencil Printing
Sn96.5Ag3.0Cu0.5 4 Water-Soluble Contains Halogen Lead-Free R520A Sn96.5Ag3.0Cu0.5 T4 89.5% 600g CRT 7019030911 Screen/Stencil Printing

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