ITASCA, IL — October 13, 2015
Contact: Michelle O’Brien, Marketing & Communications Specialist
Kester will present at the IMAPS which takes place October 27-29, 2015 at the Rosen Centre Hotel in Orlando, FL.
On
Thursday, October 29 at 2:30PM, Dan Duffy, Research Scientist, will present “Design of Filled One Step Chip Attach Materials (OSCA) for Conventional Mass Reflow Processing: Rheology Considerations for Jet Dispensing and Die Placement”.
To learn more about Kester’s product offering and capabilities, please visit our website at
www.kester.com
Speaker Biography
Daniel J. Duffy, PhD, is currently working at Kester Inc. as a Technology Development Manager and Research Scientist with a focus on developing of materials for semiconductor assembly materials and electronic packaging. He received a Ph.D. in Chemistry with research focus on physical chemistry/polymer physics and also holds a B.S. in Chemical Engineering. Both degrees were received from the University of Massachusetts at Amherst. Industrial research experience includes 8+ years focused on developing filler/particle dispersion, surface modification technology, complex fluid rheology design for industrial adhesive applications and high performance electronic packaging and assembly adhesives. Additional areas of research experience include thermodynamic/kinetic aspects of phase behavior in multi component reactive polymer blends, computational chemical modeling, molecular transport kinetics in thin polymer films, photo polymerization, molecular interactions in imprinted polymer films, diamond film coating, and spectroscopic characterization of polymers. Dan is an inventor on 5 patents and has authored over 15 publications in the fields of physical chemistry, polymers, composites and electronic assembly materials.
For any questions or additional information, please contact:
Michelle O’Brien
mobrien@kester.com
###
Kester is a global supplier of assembly materials for the Electronic Assembly and Semiconductor Packaging industries. Kester is focused on delivering innovative, robust and high-quality solutions to help our customers address their technological challenges. Kester’s current product portfolio includes soldering attachment materials such as solder paste, soldering chemicals, TSF (tacky solder flux) materials, and metal products such as bar, solid and flux-cored wire. Kester is an Illinois Tool Works (ITW) company. ITW is a Fortune 200 company that produces engineered fasteners and components, equipment and consumable systems, and specialty products. It employs approximately 49,000 people, and is based in Glenview, Illinois, with operations in 57 countries.