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Press Room | Kester

(Waterbury, CT USA) – May 12, 2022 – MacDermid Alpha Electronics Solutions, a world leader in the production of innovative materials used in semiconductor, circuitry, and electronics assembly announces the release of ALPHA HRL3 Solder Sphere, a lead-free, high reliability, low temperature alloy for ball mount applications. 

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(South Plainfield, NJ USA) – May 5, 2022 – The Assembly Division of MacDermid Alpha Electronics Solutions, a global supplier of integrated solutions from our Circuitry, Assembly and Semiconductor divisions that provides unmatched capabilities in electronics design and manufacturing will discuss solutions for voiding at the SMTA Juarez Expo & Tech Forum on Thursday, May 19.

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(South Plainfield, NJ USA) – May 4, 2022 – MacDermid Alpha Electronics Solutions, a global supplier of integrated solutions from our Circuitry, Assembly and Semiconductor divisions, will showcase its latest sintering process solutions, including the new ALPHA Argomax AccuLam Sintering Film, at the upcoming PCIM exhibition in Nuremberg, Germany from Tuesday 10th - Thursday 12th May in Hall 7 Booth #227.

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(South Plainfield, NJ USA) – May 3, 2022 – The Assembly Division of MacDermid Alpha Electronics Solutions, a global supplier of integrated solutions from our Circuitry, Assembly and Semiconductor divisions that provides unmatched capabilities in electronics design and manufacturing, will exhibit at the SMTA Michigan Expo & Tech Forum on Tuesday, May 17.

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(South Plainfield, NJ USA) – April 27, 2022 – MacDermid Alpha Electronics Solutions, a global supplier of integrated solutions from our Circuitry, Assembly and Semiconductor divisions, will showcase its latest product innovations from the ALPHA, Kester and Electrolube brands at the upcoming SMTconnect exhibition in Nuremberg, Germany from Tuesday 10th - Thursday 12th May in Hall 4 Booth # 125.

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(South Plainfield, NJ USA) – April 25, 2022 – MacDermid Alpha Electronics Solutions, a global supplier of integrated solutions from our Circuitry, Assembly and Semiconductor Divisions, in partnership with Globalspec will host “Low Temperature Solder Solutions for Defect-free Next Generation Package Designs” webinar presented by Paul Salerno, Global Portfolio Manager for SMT Solutions on Wednesday, May 25 at 2:00 pm EDT.

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(Waterbury, CT USA) – April 21, 2022 – At MacDermid Alpha, we understand how important sustainability is to our customers, investors and employees. To commemorate Earth Day and the anniversary of our businesses, we are excited to announce that the ESI Foundation has made a $15,000 donation to The Canopy Project - 250 trees will be planted for each of our 60 facilities around the world, 100 trees to celebrate MacDermid’s 100th anniversary and 150 trees to celebrate Alpha’s 150th anniversary.

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(South Plainfield, NJ USA) – April 19, 2022 – Electrolube, a brand of MacDermid Alpha will be exhibiting at the initial SbSTC technical conference in Shenzhen, China on the 22nd of April. The team will be sharing their expertise on Conformal Coatings, both at the exhibition as well as presenting one of their popular articles entitled “Pre and Post Coating Variables That Cause Board Failure” and the importance of ensuring a conformal coating meets the desired requirements. Electrolube is amongst the world’s foremost thought leaders in conformal coatings, encapsulation resins and thermal management solutions and is pleased to be presenting at SbSTC.

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(South Plainfield, NJ USA) – April 1, 2022 – The Assembly Division of MacDermid Alpha Electronics Solutions, a global supplier of integrated solutions from our Circuitry, Assembly and Semiconductor divisions that provides unmatched capabilities in electronics design and manufacturing, will exhibit at the SMTA Huntsville Expo & Tech Forum on Tuesday, April 12 at The Jackson Center.

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(Waterbury, CT USA) – March 14, 2022 – MacDermid Alpha Electronics Solutions, a global leader of integrated solutions from our Circuitry, Assembly and Semiconductor divisions that provides unmatched capabilities in innovative electronics design and manufacturing, will be presenting the technical paper Next Generation Interconnect Materials for Smart, Functional, and 3D HMI Surfaces” at the LOPEC 2022 Exhibition and Conference taking place March 22 - 24, 2022 at the Messe München, Germany.

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