Use the links below to meet the authors and download Kester’s latest publications at recent conferences.
Bruno Tolla is the Global Director of R&D for Kester. He received a Ph.D. in Materials Science from the University of Bordeaux (France), and also holds a Masters in Chemical Engineering from the European School of Chemistry, Polymers and Materials in Strasbourg (France). Bruno has 15+ years of experience in the design, development and manufacturing of specialty chemicals and materials for various segments of the electronics industries, including Fuel Cells, Wafer manufacturing, Photovoltaics and Semiconductor Packaging. He holds 8 patents and has authored 7 publications in the fields of Colloidal Science, Materials Chemistry and Electronics Assembly.
Paper: Reactivity of No-Clean Flux Residues trapped under Bottom Terminated Components can Cause Leakage Currents to Form
Paper: Surface Insulation Resistance of No-clean Flux Residues Under Various Surface Mount Components
These papers are also published in the proceedings of SMTA International 2016 and can be found here.
Paper: REACTIVITY OF NO-CLEAN FLUX RESIDUES IN ELECTRONIC ASSEMBLIES: A SYSTEMATIC STUDY
Interview with RealTime
Paper: Chemical Influences on the Reliability of Complex Assemblies
Paper: Effect of Flux Systems on Electrochemical Migration of Lead-Free Assembly
Yanrong Shi, PhD, is a Research Scientist who designs new products in support of Kester’s strategic focus on delivering innovative, robust and high-quality solutions to help its customers address the technological challenges of the semiconductor packaging and electronic assembly industry. Yanrong leads the early development stages of the projects, and is accountable for the creativity and technical value of inventions, the scientific knowledge gained during the process and the manufacturability of the products. Yanrong obtained her Ph.D. in Chemistry from the Georgia Institute of Technology. Before joining Kester, she worked as a Postdoc Research Fellow on developing organic materials for optics and electronics in the Department of Chemistry at Northwestern University. Yanrong has published several highly cited papers in peer-reviewed journals and presentations at international conferences.
Paper: "Partially-Activated" Flux Residue Impacts on Electronic Assembly Reliabilities
Paper: The Role of Organic Amines in Soldering Materials
Abstract: Smart Chemistry Towards Highly Efficient Soldering Material Formulation
Paper: Smart Chemistry Towards Highly Efficient Soldering Material Formulation
Presentation: Smart Chemistry Towards Highly Efficient Soldering Material Formulation
Chad Showalter is the Global Products Manager for Wire and Preforms at Kester. He received a B.S. degree in Chemical Engineering from Iowa State University. Chad has 15+ years of experience in electronics assembly materials including product design, process and assembly equipment for surface mount and through-hole soldered assemblies. Chad is primarily involved with interfacing with customers Kester’s R&D organization to ensure Kester’s current and future products provide value-add solutions to customer problems.
Paper: A Study of Overcoming Solder Icicling and Copper Wire Dissolution in an Automated Lead-Free Soldering
This paper is also published in the proceedings of SMTA International 2016 and can be found here.
Denis Jean is a Technology Manager with Kester, and primarily involved with interfacing with customers and Kester R&D organization to provide value-add solutions to customer opportunities and/or problems.
Denis has over 30 years of experience of supporting both domestic and foreign OEM’s and EMS companies in product design, process and assembly/rework equipment development for surface mount and through-hole soldered assemblies.
Denis has authored, instructed and presented frequently on topics including through hole soldering (wave/selective), SMT assembly, DFM/DFX and rework. He has received 2 patents for his work with polymer thick film technology. He is presently serving on the SMTA-I Technical Committee.
Paper: How to use the right flux for the selective soldering application
Hemal Bhavsar is Product Development Chemist who works on development of polymeric materials to address technological challenges and innovative ideas to solve customer issues in semiconductor packaging and electronics industry. He received Bachelor of Science in Chemistry from Benedictine University and Master of Science in Polymer Chemistry from DePaul University. MS thesis focused on synthesis of monomer and copolymerization of thermoplastic materials. He is experienced with multifunctional reactive polymer blend, rheology method development, nm sized particle dispersion, thermally conductive adhesive and polyamide blocked copolymer.
Paper: Improved Reliability Performance of Jet Dispensable Polymeric Coating Material
Daniel J. Duffy, PhD, is a Technology Development Manager and Research Scientist with a focus on developing of materials for semiconductor assembly materials and electronic packaging. He received a Ph.D. in Chemistry with research focus on physical chemistry/polymer physics and also holds a B.S. in Chemical Engineering. Both degrees were received from the University of Massachusetts at Amherst. Daniel’s industrial research experience includes 8+ years focused on developing filler/particle dispersion, surface modification technology, complex fluid rheology design for industrial adhesive applications and high performance electronic packaging and assembly adhesives. Additional areas of research experience include thermodynamic/kinetic aspects of phase behavior in multi component reactive polymer blends, computational chemical modeling, molecular transport kinetics in thin polymer films, photo polymerization, molecular interactions in imprinted polymer films, diamond film coating and spectroscopic characterization of polymers. Daniel is an inventor on 5 patents and has authored over 15 publications in the fields of physical chemistry, polymers, composites and electronic assembly materials.
Abstract: Design of Filled One Step Chip Attach Materials for Conventional Mass Reflow Processing Curing Kinetics and Solder Reflow Aspects
Paper: Design of Filled One Step Chip Attach Materials for Conventional Mass Reflow Processing Curing Kinetics and Solder Reflow Aspects
Presentation: Design of Filled One Step Chip Attach Materials for Conventional Mass Reflow Processing Curing Kinetics and Solder Reflow Aspects
Paper: Rheology Design Considerations for One Step Chip Attach Materials (OSCA) used for Conventional Mass Reflow Processing
Presentation: Rheology Design Considerations for One Step Chip Attach Materials (OSCA) used for Conventional Mass Reflow Processing
Paper:Design of Filled One Step Chip Attach Materials (OSCA) for Conventional Mass Reflow Processing: Rheology Considerations for Jet Dispensing and Die Placement
Abstract: One Step Chip Attach Materials (OSCA) for Conventional Mass Reflow Processing
Paper: One Step Chip Attach Materials (OSCA) for Conventional Mass Reflow Processing
Presentation: One Step Chip Attach Materials (OSCA) for Conventional Mass Reflow Processing
Paper: 3D and 2.5D Packaging Assembly with Highly Silica filled One Step Chip Attach Materials for both Thermal Compression Bonding and Mass Reflow Processes