Find Distributor

Publications | Kester

Use the links below to meet the authors and download Kester’s latest publications at recent conferences.

Bruno Tolla, Ph.D.

Bruno Tolla, Ph.D.

Bruno Tolla is the Global Director of R&D for Kester. He received a Ph.D. in Materials Science from the University of Bordeaux (France), and also holds a Masters in Chemical Engineering from the European School of Chemistry, Polymers and Materials in Strasbourg (France). Bruno has 15+ years of experience in the design, development and manufacturing of specialty chemicals and materials for various segments of the electronics industries, including Fuel Cells, Wafer manufacturing, Photovoltaics and Semiconductor Packaging. He holds 8 patents and has authored 7 publications in the fields of Colloidal Science, Materials Chemistry and Electronics Assembly.

IPC-SMTA Cleaning and Conformal Coating Conference: Building Reliable Hardware

Presentation

Global SMT & Packaging QFN: Design – Cleaning – Reliability: What you can’t see can cause failure! Webinar

Recorded Webinar

SMTA International 2016

Paper: Reactivity of No-Clean Flux Residues trapped under Bottom Terminated Components can Cause Leakage Currents to Form

Paper: Surface Insulation Resistance of No-clean Flux Residues Under Various Surface Mount Components

These papers are also published in the proceedings of SMTA International 2016 and can be found here.

SMTA International 2015

Paper: REACTIVITY OF NO-CLEAN FLUX RESIDUES IN ELECTRONIC ASSEMBLIES: A SYSTEMATIC STUDY

IPC APEX 2015

Interview with RealTime

SMTA South East Asia 2015

Abstract

Paper: Chemical Influences on the Reliability of Complex Assemblies

Presentation

2014 IPC Europe High Reliability Forum

Presentation

SMTA International 2014

Abstract

Paper: Effect of Flux Systems on Electrochemical Migration of Lead-Free Assembly


Yanrong Shi, Ph.D.

Yanrong Shi, Ph.D.

Yanrong Shi, PhD, is a Research Scientist who designs new products in support of Kester’s strategic focus on delivering innovative, robust and high-quality solutions to help its customers address the technological challenges of the semiconductor packaging and electronic assembly industry. Yanrong leads the early development stages of the projects, and is accountable for the creativity and technical value of inventions, the scientific knowledge gained during the process and the manufacturability of the products. Yanrong obtained her Ph.D. in Chemistry from the Georgia Institute of Technology. Before joining Kester, she worked as a Postdoc Research Fellow on developing organic materials for optics and electronics in the Department of Chemistry at Northwestern University. Yanrong has published several highly cited papers in peer-reviewed journals and presentations at international conferences.

SMTA China East 2016

Paper: "Partially-Activated" Flux Residue Impacts on Electronic Assembly Reliabilities

IPC APEX 2015

Paper: The Role of Organic Amines in Soldering Materials

SMTA International 2014

Abstract: Smart Chemistry Towards Highly Efficient Soldering Material Formulation

Paper: Smart Chemistry Towards Highly Efficient Soldering Material Formulation

Presentation: Smart Chemistry Towards Highly Efficient Soldering Material Formulation


Chad Showalter

Chad Showalter is the Global Products Manager for Wire and Preforms at Kester. He received a B.S. degree in Chemical Engineering from Iowa State University. Chad has 15+ years of experience in electronics assembly materials including product design, process and assembly equipment for surface mount and through-hole soldered assemblies. Chad is primarily involved with interfacing with customers Kester’s R&D organization to ensure Kester’s current and future products provide value-add solutions to customer problems.

SMTA International 2016

Paper: A Study of Overcoming Solder Icicling and Copper Wire Dissolution in an Automated Lead-Free Soldering

This paper is also published in the proceedings of SMTA International 2016 and can be found here.


Hemal Bhavsar

Hemal Bhavsar is Product Development Chemist who works on development of polymeric materials to address technological challenges and innovative ideas to solve customer issues in semiconductor packaging and electronics industry. He received Bachelor of Science in Chemistry from Benedictine University and Master of Science in Polymer Chemistry from DePaul University. MS thesis focused on synthesis of monomer and copolymerization of thermoplastic materials. He is experienced with multifunctional reactive polymer blend, rheology method development, nm sized particle dispersion, thermally conductive adhesive and polyamide blocked copolymer.

SMTA International 2016

Paper: Improved Reliability Performance of Jet Dispensable Polymeric Coating Material

These papers are also published in the proceedings of SMTA International 2016 and can be found here.


Denis Jean

Denis Jean is a Technology Manager with Kester, and primarily involved with interfacing with customers and Kester R&D organization to provide value-add solutions to customer opportunities and/or problems. Denis has over 30 years of experience of supporting both domestic and foreign OEM’s and EMS companies in product design, process and assembly/rework equipment development for surface mount and through-hole soldered assemblies. Denis has authored, instructed and presented frequently on topics including through hole soldering (wave/selective), SMT assembly, DFM/DFX and rework. He has received 2 patents for his work with polymer thick film technology. He is presently serving on the SMTA-I Technical Committee.

SMTAI International 2016

Paper: Breaking Through Flux Residues to Provide Reliable Probing on PCBAs

This paper is also published in the proceedings of SMTA International 2016 and can be found here.

IPC APEX 2016

Paper: How to use the right flux for the selective soldering application


Daniel Duffy, Ph.D.

Daniel Duffy, Ph.D.

Daniel J. Duffy, PhD, is a Technology Development Manager and Research Scientist with a focus on developing of materials for semiconductor assembly materials and electronic packaging. He received a Ph.D. in Chemistry with research focus on physical chemistry/polymer physics and also holds a B.S. in Chemical Engineering. Both degrees were received from the University of Massachusetts at Amherst. Daniel’s industrial research experience includes 8+ years focused on developing filler/particle dispersion, surface modification technology, complex fluid rheology design for industrial adhesive applications and high performance electronic packaging and assembly adhesives. Additional areas of research experience include thermodynamic/kinetic aspects of phase behavior in multi component reactive polymer blends, computational chemical modeling, molecular transport kinetics in thin polymer films, photo polymerization, molecular interactions in imprinted polymer films, diamond film coating and spectroscopic characterization of polymers. Daniel is an inventor on 5 patents and has authored over 15 publications in the fields of physical chemistry, polymers, composites and electronic assembly materials.

48th International Symposium on Microelectronics (IMAPS 2015)

Abstract: Design of Filled One Step Chip Attach Materials for Conventional Mass Reflow Processing Curing Kinetics and Solder Reflow Aspects

Paper: Design of Filled One Step Chip Attach Materials for Conventional Mass Reflow Processing Curing Kinetics and Solder Reflow Aspects

Presentation: Design of Filled One Step Chip Attach Materials for Conventional Mass Reflow Processing Curing Kinetics and Solder Reflow Aspects

ECTC 2015

Paper: Rheology Design Considerations for One Step Chip Attach Materials (OSCA) used for Conventional Mass Reflow Processing

Presentation: Rheology Design Considerations for One Step Chip Attach Materials (OSCA) used for Conventional Mass Reflow Processing

11th International Conference & Exhibition on Device Packaging

Paper:Design of Filled One Step Chip Attach Materials (OSCA) for Conventional Mass Reflow Processing: Rheology Considerations for Jet Dispensing and Die Placement

47th International Symposium on Microelectronics (IMAPS 2014)

Abstract: One Step Chip Attach Materials (OSCA) for Conventional Mass Reflow Processing

Paper: One Step Chip Attach Materials (OSCA) for Conventional Mass Reflow Processing

Presentation: One Step Chip Attach Materials (OSCA) for Conventional Mass Reflow Processing

Electronic Components and Technology Conference (ECTC) 2014

Paper: 3D and 2.5D Packaging Assembly with Highly Silica filled One Step Chip Attach Materials for both Thermal Compression Bonding and Mass Reflow Processes