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Press Room | Kester

Kester is proud to announce the launch of 268 Flux-Cored Wire, a zero-halogen wire optimized for robotic soldering applications. 

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Kester will be exhibiting (booth #67) at the SMTA Guadalajara 2017, which will take place October 18-19 at the Hotel RIU in Guadalajara. For more information on the show, please click here, or contact Francisco Barajas at fbarajas@kester.com

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Kester will be exhibiting (booth #1123) at Surface Mount Technology Association International (SMTAI) 2017, which will take place September 19-20 at the Donald Stephens Convention Center in Rosemont, IL.

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Kester’s NP545, the zero-halogen, no-clean solder paste formula designed for consistency and repeatability is now available in a Tin-Lead T4 powder. For additional information on this product including technical and safety data sheets, please visit http://www.kester.com/products/product/np545-solder-paste.

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Kester is honored to have won a 2017 Preferred Supplier Award.

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Kester will be exhibiting (booth #349 and 366) alongside Kemtronix at PSECE 2017 which will take place June 21-23 at the SMX Convention Center in Manila, PhilippinesPSECE is the biggest annual industry event produced and organized by SEIPI, the leading organization of more than 300 electronics firms and supply chain companies in the Philippines.

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Kester’s NP505-HR, the  zero-halogen, lead-free, no-clean solder paste, that was developed specifically for high-reliability ap­plications, is now available with a T5 powder. For additional information on this product including technical and safety data sheets, please visit http://www.kester.com/products/product/np505-hr-solder-paste.

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Kester is proud to announce the launch of SF800-LR. SF800-LR  is a zero-halogen, low-residue, low-solids, organic based liquid flux designed specifically for tabbing and stringing applications. The formulation delivers excellent solderability in module assembly processes utilizing conduction, IR and convection reflow. It is formulated to deliver minimum flux residue thus eliminating post cleaning after soldering. Cells are dry and cosmetically clean as they exit the tabber and stringer equipment. SF800-LR provides excellent solderability on all type of metalizations. The formulation of SF800-LR is also designed to deliver excellent peel force that result in long term stability of the solder joints.

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On Tuesday, May 23, Kester’s Bruno Tolla and Kyzen’s Mike Bixenman will present “Impact of Reflow and Cleaning Conditions on the Electrochemical Activity of Flux Residues under Surface Mount Components” at the Contamination, Cleaning and Coating Conference. The conference will take place May 22-24 at the Radisson Blu Hotel Amsterdam Airport Schiphol in Amsterdam, Netherlands. Click here for more information the technical conference.

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Kester will be exhibiting (booth #1H43) at SMTA China East/NEPCON, which will take place April 25-27 at the Shanghai World Expo Exhibition & Convention Center. Kester’s booth will offer attendees the opportunity to meet with the sales team and learn more about Kester’s new products. 

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