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Events | Kester

Upcoming Events

Kurtz Ersa Soldering Seminar & Grand Opening

Demo & Technology Center - Jalisco, Mexico

Technical Seminars: November 15th and 16th and Opening: November 17th

Speaker Schedule

Denis Jean, November 15 & 16, 9:30 AM

"How to formulate the right flux for the selective soldering application"

IPC APEX EXPO 2017

San Diego Convention Center - San Diego, CA

Booth 2205

February 14-16, 2017

Past Events

MATELEC 2016

Ifema - Feria de Madrid – Madrid, Spain

October 25-28, 2016

SMTA-IPC High-Reliability Cleaning and Conformal Coating Conference

Hyatt Rosemont - Rosemont, IL

October 25-27, 2016

Speaker Schedule

Bruno Tolla, October 26, 9:45 AM

“No-Clean Flux Activity under Bottom Terminations”

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Taiwan International Photovoltaic Exhibition

Taipei Nangang Exhibition Center - Taiwan

Booth # K0408

October 12-14, 2016

“QFN: Design - Cleaning - Reliability: What you can't see can cause failure!” Webinar

Thursday, October 13, 2016 10:00AM - 11:00AM CDT

Speaker Schedule

Bruno Tolla will be a panelist during this free webinar.

To learn more information and to register for the webinar, please click here.

SMTA International

Donald Stephens Convention Center – Rosemont, IL

Booth 500

September 27 – 28, 2016

Speaker Schedule, Sptember 27

Paul Groome (Digitaltest), and Kester's Denis Jean and Bruno Tolla, September 27, 11:30AM

Breaking Through Flux Residues to Provide Reliable Probing on PCBAs

Bruno Tolla, 2-2:30pm

Surface Insulation Resistance of No-clean Flux Residues Under Various Surface Mount Components

Mike Bixenman (Kyzen) and Bruno Tolla, 3-3:30pm

Reactivity of No-Clean Flux Residues Trapped Under Bottom Terminated Components Can Cause Leakage Currents to Form

Hemal Bhavsar, 3-3:30pm

Improved Reliability Performance of Jet Dispensable Polymeric Coating Material

Speaker Schedule, Wednesday, September 28

Chad Showalter, 3-3:30pm

A Study of Overcoming Solder Icicling and Copper Wire Dissolution in an Automated Lead-Free Soldering System

SMTA Guadalajara Expo Forum 2016

Hotel RIU Guadalajara

Booth 39

October 4 – 5, 2016

2016 SNEC International Photovoltaic Power Generation Conference & Exhibition

Kerry Hotel Pudong, Shanghai

Booth E3 – 375

May 23-25, 2016

2016 Carolinas Expo & Tech Conference

Holiday Inn Greensboro Airport, Greensboro, NC

Booth 20

May 24, 2016

NEPCON China 2016

Shanghai World EXPO Exhibition & Convention Center

Booth 1G40, Hall 1

April 26-28, 2016

Speaker Schedule

Yanrong Shi, Chemist, April 27, 10:30AM

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SMT Hybrid Packaging 2016

Exhibition Centre, Nuremberg, Germany

April 26-28, 2016

SMTA Atlanta 20th Annual Expo

Infinite Energy Center (formerly Gwinnett Center), Duluth, GA

April 20, 2016

Anglo Production Processes Ltd.’s. Technology Days

APP's UK Headquarters, Bromsgrove, Worcestershire, England

April 20-21, 2016

SMTA Dallas

Plano Centre, Plano, TX

Booth 416

March 3, 2016

Speaker Schedule

Bruno Tolla, Global R&D Director, March 3, 1:30 PM

Impact of Flux Residues on the Reliability of Electronic Assemblies

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IPC APEX EXPO 2016

Las Vegas Convention Center, Las Vegas, NV

Booth 757

March 15-17, 2016

Speaker Schedule

Denis Jean, Technical Support, March 15, 3:30 PM

How to Choose the Right Flux for the Selective Soldering Application

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PCB Carolina 2015

McKimmon Center, NCSU, Raleigh, NC

Table #11

November 4, 2015

Productronica

Messe München International, Munich, Germany

Booth A4.554

November 10-13, 2015

48th International Symposium on Microelectronics - IMAPS

Rosen Centre Hotel, Orlando, FL

October 27-29, 2015

Speaker Schedule

Dan Duffy, Research Scientist, October 29, 2:30 PM

Design of Filled One Step Chip Attach Materials (OSCA) for Conventional Mass Reflow Processing: Rheology Considerations for Jet Dispensing and Die Placement

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12th Annual International Wafer-Level Packaging Conference and Tabletop Exhibition

DoubleTree San Jose Airport Hotel, San Jose, CA

October 13-15, 2015

Speaker Schedule

Dan Duffy, Research Scientist, October 14, 10:45 AM

Assemblies Containing Copper Pillar Structures Processed Using One Step Chip Attach Materials (OSCA) and Conventional Mass Reflow Processing

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SMTA Guadalajara 2015

Hotel Riu Plaza Guadalajara, Guadalajara, Mexico

October 14-15, 2015

SMTA International 2015

Donald Stephens Convention Center Rosemont, IL

Booth 131

September 27-October 1, 2015

Speaker Schedule

Xiang (Shawn) Wei, Ph.D., September 29, 2:00 PM

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Bruno Tolla, Global R&D Director, October 1, 10:30 AM

Reactivity of No-Clean Flux Residues in Electronic Assemblies: A Systematic Study

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NEPCON South China

Shenzhen Convention and Exhibition Centre

August 25-27, 2015

ECTC

Sheraton San Diego Hotel & Marina

May 26-29, 2015

Speaker Schedule

Dan Duffy, Research Scientist, May 25, 11:15 AM

Rheology Design Considerations for One Chip Attach Materials (OSCA) Used for Conventional Mass Reflow Processing

NEPCON China

Shanghai World Expo Convention Center

April 21-23, 2015

Speaker Schedule

Bruno Tolla, Global R&D Director, April 15, 10:30 AM

Chemical Influences on the Reliability of Complex Assemblies