| Halogen-Free |
TSF-6592HF 30g SYR |
302703 |
No-Clean |
BGA Sphere Attach, Chip Attach, Flip Chip BGA/PGA/LGA, Flip Chip CSP, Flip Chip on Board, Package on Package, QFN, SiP, Traditional Leadframe, Wafer CSP, Wafer Level Packaging, Wire Bond BGA, Wire Bond CSP |
Dipping, Dispensing, Pin Transfer, Printing, Screen/Stencil Printing
|
Ball Attach, Flip Chip Attach, Solder Ball Attach |