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TSF-6592HF

TSF-6592HF

Kester TSF-6592HF is a no-clean paste flux designed as a lead-free solution for an array of lead-free interconnect applications such as flip chip attach, sphere or ball attach, rework/repair of CSPs, BGAs, SMDs, or any lead-free soldering application that requires a very tacky flux. It has been optimized for consistent high speed printing applications. Share Find A Distributor To Buy
Halogen Content Description Part # Type Process Application Package
Halogen-Free TSF-6592HF 30g SYR 302703 No-Clean BGA Sphere Attach, Chip Attach, Flip Chip BGA/PGA/LGA, Flip Chip CSP, Flip Chip on Board, Package on Package, QFN, SiP, Traditional Leadframe, Wafer CSP, Wafer Level Packaging, Wire Bond BGA, Wire Bond CSP Dipping, Dispensing, Pin Transfer, Printing, Screen/Stencil Printing
Ball Attach, Flip Chip Attach, Solder Ball Attach

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