SE-CURE™ 9650D
Kester SE-CURE™ 9650D is an ultra low residue, no-clean liquid flux designed to be compatible with standard underfill materials. SE-CURE™ 9650D is an engineered product that eliminates the need to clean flip chip assemblies prior to underfill operations. This flux residue-to-underfill compatibility increases the overall adhesion of the polymer underfill system resulting in improved component integrity.
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