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NP560 Solder Paste

NP560 Solder Paste

NP560 is a no-clean, lead-free, halogen-free solder paste. It consistently delivers paste transfer efficiencies of 0.50 to 0.55 AR and is fully capable of printing and reflowing 01005 components, even in air, with minimal graping behavior. In addition to its stable, consistent product performance, NP560 has redefined the voiding standard for PCB assembly and has the potential for low voiding performance.

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Alloy Powder Size Type Halogen Content Lead Content Description Part # Process
Sn96.5Ag3.0Cu0.5 4 No-Clean Halogen-Free Lead-Free NP560 Sn96.5Ag3.0Cu0.5 T4 88.3% 500g JAR 7048230910 Screen/Stencil Printing
Sn96.5Ag3.0Cu0.5 4 No-Clean Halogen-Free Lead-Free NP560 Sn96.5Ag3.0Cu0.5 T4 88.3% 600g CRT 7048230911 Screen/Stencil Printing
Sn96.5Ag3.0Cu0.5
4 No-Clean Halogen-Free Lead-Free NP560 Sn96.5Ag3.0Cu0.5 T4 86.5% 100g SYR 7048250904  Screen/Stencil Printing
Sn96.5Ag3.0Cu0.5
5 No-Clean Halogen-Free Lead-Free NP560 Sn96.5Ag3.0Cu0.5 T5 88% 500g JAR 7048062210  Screen/Stencil Printing