EM918 Solder Paste
Kester EM918 is a lead-free, halide-free, air and nitrogen reflowable, ICT pin probable, no-clean solder paste specifically designed for the thermal requirements of lead-free alloys, including the SAC305 alloy. EM918 is capable of stencil printing downtimes up to 60 minutes with an effective first print down to 20 mils without kneading. EM918 also exhibits excellent continual printability for the fine pitch (0.4mm/16 mils) and is able to print at high speeds up to 6 in/s (150mm/s). EM918 offers excellent cosmetic appearance in the reflowed solder joints with smooth solder and light colored residues, closely resembling tin-lead joints. EM918 is classified as Type ROL0 flux under IPC ANSI/J-STD-004A Joint Industry Standard.