Find Distributor

Products

EM907 Solder Paste

EM907 Solder Paste

Kester EM907 is a lead-free, air and nitrogen reflowable, no-clean solder paste specifically designed for the thermal requirements of lead-free alloys, including the SAC305 alloy. The paste flux system allows joint appearances that closely resemble that achieved with SnPb alloys. EM907 is capable of stencil printing downtimes up to 60 minutes with an effective first print down to 20 mils without any kneading. EM907 also exhibits excellent continual printability for fine pitch (0.4mm/16 mils) and is able to print at high speeds up to 6 in/s (150 mm/s). This solder paste also exceeds the reliability standards required by J-STD-004. Share Find A Distributor To Buy
Alloy Powder Size Type Halogen Content Lead Content Description Part # Process
Sn96.5Ag3.0Cu0.5 3 No-Clean Contains Halogen Lead-Free EM907 Sn96.5Ag3.0Cu0.5 T3 88.5% 500g JAR 7006050810 Screen/Stencil Printing
Sn96.5Ag3.0Cu0.5 3 No-Clean Contains Halogen Lead-Free EM907 Sn96.5Ag3.0Cu0.5 T3 88.5% 600g CRT 7006050811 Screen/Stencil Printing
Sn96.5Ag3.0Cu0.5 3 No-Clean Contains Halogen Lead-Free EM907 Sn96.5Ag3.0Cu0.5 T3 88.5% 750g DEK 7006050819 Screen/Stencil Printing
Sn96.5Ag3.0Cu0.5 4 No-Clean Contains Halogen Lead-Free EM907 Sn96.5Ag3.0Cu0.5 T4 88.5% 500g JAR 7006050910 Screen/Stencil Printing
Sn96.5Ag3.0Cu0.5 4 No-Clean Contains Halogen Lead-Free EM907 Sn96.5Ag3.0Cu0.5 T4 88.5% 600g CRT 7006050911 Screen/Stencil Printing
Sn96.5Ag3Cu0.5 3 No-Clean Contains Halogen Lead-Free EM907 11.5% Sn96.5Ag3Cu0.5 25-45µ 500g J 41500605 Screen/Stencil Printing
Sn96.5Ag3Cu0.5 4 No-Clean Contains Halogen Lead-Free EM907 11.5% Sn96.5Ag3Cu0.5 20-38µ 500g J 41500607 Screen/Stencil Printing

Process Compatible Products