ALPHA HiTech CU31-2030 is a one-component capillary underfill designed for the protection of assembled chip packages onto printed circuit boards. It is a low viscosity underfill which enables fast and efficient flow properties. In addition, it has a high Tg and low modulus which results in excellent reliability performance. ALPHA HiTech CU31-2030 is suitable for assembling BGA, CSP and Flip Chip devices.
- Low viscosity
- Room temperature flow capability
- High Glass Transition Temperature (Tg)
- Low modulus
- Excellent reliability performance
- Halogen-free and complies with RoHS Directive 2015/863/EU