ALPHA HiTech CU21-3240 is a one-component capillary underfill designed for the protection of assembled chip packages onto printed circuit boards. It is a high Tg & low CTE underfill with excellent reliability. It also has a good thermal cycling performance because of its low Coefficient of Thermal Expansion.
- Provides full component coverage when dispensed onto the substrate preheated at 70-100 °C.
- High Tg and low CTE values drastically improve the product’s ability to pass a more stringent Thermal Cycling Test condition.
- Excellent Thermal Cycling Test performance.
- Halogen-free and complies with RoHS Directive 2015/863/EU.