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CU21-3240

CU21-3240

ALPHA HiTech CU21-3240 is a one-component capillary underfill designed for the protection of assembled chip packages onto printed circuit boards. It is a high Tg & low CTE underfill with excellent reliability. It also has a good thermal cycling performance because of its low Coefficient of Thermal Expansion.

 

Key Features:

  • Provides full component coverage when dispensed onto the substrate preheated at 70-100 °C.
  • High Tg and low CTE values drastically improve the product’s ability to pass a more stringent Thermal Cycling Test condition.
  • Excellent Thermal Cycling Test performance.
  • Halogen-free and complies with RoHS Directive 2015/863/EU.
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Halogen Content Container Size Part # Application
Halogen-Free 10cc EFD
264709.0015GME
Dispensing, Jetting
Halogen-Free 10cc MUS
264709.0015GMM
Dispensing, Jetting
Halogen-Free 30cc EFD
264709.0045GME
Dispensing, Jetting
Halogen-Free
30cc MUS
264709.0045GMM
Dispensing, Jetting
Halogen-Free
50cc EFD
264709.0070GME
Dispensing, Jetting
Halogen-Free
50cc IWA
264709.0070GMI
Dispensing, Jetting
Halogen-Free
50cc MUS
264709.0070GMM
Dispensing, Jetting