ALPHA HiTech CU11-3127, a product with high filler content, is available to provide better mechanical strength for CSP and Flip Chip packages. ALPHA HiTech CU11-3127 provides full bottom component coverage at room temperature. A higher preheat temperature up < 80 °C may be applied to the substrate for a faster underfill flow rate.
- Low moisture absorption
- Releases stress over a large area, primary stress is CTE mismatch between component and board
- High Glass Transition Temperature (Tg)
- Low Coefficient of Thermal Expansion
- Complies with RoHS Directive 2011/65/EU