909HPS Solder Paste
Kester 909HPS is a lead-free, air and nitrogen reflowable, no-clean solder paste specifically designed for the thermal requirements of lead-free alloys, including the Sn96.5Ag3.0Cu0.5 alloy. The paste flux system allows joint appearances that closely resemble that achieved with SnPb alloys. 909HPS is capable of stencil printing downtimes up to 60 minutes with an effective first print down to 20 mils without any kneading. 909HPS also exhibits excellent continual printability for fine pitch (0.4mm/16 mils) and is able to print at high speeds up to 6in/s (150 mm/s). This solder paste also exceeds the reliability standards required byJ-STD-004.