2169 Soldering Flux
Kester 2169 is a halide-free, organic flux that is designed for semiconductor component lead tinning and PCB soldering. This flux provides good activity on metals such as Nickel Iron (Alloy 42), nickel plate and copper alloy. Proper use of 2169 results in a non-porous solder coating in which a continuous, uniform metallurgical bond is formed with the base metal. The unique activity and surface tension properties of flux minimize soldering defects such as icicles, bridging, excessive solder or white residues in component dipping.