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TSF-8818HF

TSF-8818HF

Kester TSF-8818HF is a water-soluble, tacky soldering flux formula with a unique halogen-free activator system. TSF-8818HF is designed to have high tackiness to minimize component movement and misalignment during reflow, especially thin flip chip dice. TSF-8818HF is highly active even without halogens and can be used as a drop-in replacement for a variety of metallurgies including: Sn-Pb eutectic and higher melting point lead-free alloys such as SnAg, SnCu, SnAgCu etc. Post-reflow, residues are completely soluble in water and do not require cleaning additives. Share Find A Distributor To Buy
Halogen Content Description Part # Type Process Application Package
Halogen-Free TSF-8818HF 30g SYR 301903 Water-Soluble Printing, Dipping, Dispensing Flip Chip Attach, Ball Attach, Solder Ball Attach Wire Bond BGA, Flip Chip BGA, Wire Bond CSP, Flip Chip CSP, Traditional Leadframe, QFN, Package on Package, SiP, Wafer CSP