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TSF-8808

TSF-8808

Kester TSF-8808 is a synthetic water soluble tacky soldering flux formula. TSF-8808 has no intentionally added halogens. It is specifically formulated to meet the IEC 61249-2-21 definition for halide free materials. TSF-8808 is designed to have low volatiles to reduce outgassing during reflow. This minimizes component movement and misalignment during reflow especially thin flip chip die. TSF-8808 can be a drop in replacement for a variety of metallurgies; such as low melting point alloys (SnBi, etc.), typical tin-lead eutectic and the higher melting point alloys (SnAg, SnCu, SnAgCu, etc.). Post reflow the residues are completely soluble in water and do not require any cleaning additives. To reduce the cost of assembling, DI water can be used to remove TSF-8808 residues.

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Halogen Content Description Part # Type Process Application Package
Zero-Halogen TSF-8808 30g SYR 301303 Water-Soluble Printing, Dipping, Dispensing Flip Chip Attach, Ball Attach, Solder Ball Attach Wire Bond BGA, Flip Chip BGA, Wire Bond CSP, Flip Chip CSP
Zero-Halogen TSF-8808 165g CRT 301306 Water-Soluble Printing, Dipping, Dispensing Flip Chip Attach, Ball Attach, Solder Ball Attach Wire Bond BGA, Flip Chip BGA, Wire Bond CSP, Flip Chip CSP
Zero-Halogen TSF-8808 10g SYR 301302 Water-Soluble Printing, Dipping, Dispensing Flip Chip Attach, Ball Attach, Solder Ball Attach Wire Bond BGA, Flip Chip BGA, Wire Bond CSP, Flip Chip CSP

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