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TSF-6852

TSF-6852

Kester TSF-6852 is a synthetic water-soluble tacky soldering flux. The synthetic ingredients eliminate naturally occurring raw materials typically found in fluxes. This maximizes lot-to-lot consistency. TSF-6852 is room temperature stable and does not require refrigeration for long-term storage. This reduces production line space for material storage and the cost of refrigerated storage. TSF-6852 has been formulated to be a drop in replacement for a variety of metallurgies. These include low melting point alloys (SnBi, SnBiAg, etc.), typical tin-lead eutectic alloys and the higher melting point, lead-free alloys (SnAg, SnCu, SnAgCu, SnSb, etc.). Post reflow, the residues are completely soluble in water and do not require any cleaning additives. To reduce the cost of assembling, room temperature or cool water (<65ºC) can be used to remove TSF-6852 residues. Share Find A Distributor To Buy
Halogen Content Description Part # Type Process Application Package
Contains Halogen TSF-6852 30g SYR 300203 Water-Soluble Printing, Dipping, Dispensing Flip Chip Attach, Ball Attach, Solder Ball Attach Wire Bond BGA, Flip Chip BGA, Wire Bond CSP, Flip Chip CSP, Package on Package, SiP, Wafer CSP
Contains Halogen TSF-6852 100g JAR 300204 Water-Soluble Printing, Dipping, Dispensing Flip Chip Attach, Ball Attach, Solder Ball Attach Wire Bond BGA, Flip Chip BGA, Wire Bond CSP, Flip Chip CSP, Package on Package, SiP, Wafer CSP
Contains Halogen TSF-6852 15g SYR 300214 Water-Soluble Printing, Dipping, Dispensing Flip Chip Attach, Ball Attach, Solder Ball Attach Wire Bond BGA, Flip Chip BGA, Wire Bond CSP, Flip Chip CSP, Package on Package, SiP, Wafer CSP
Contains Halogen TSF-6852 165g CRT 301706 Water-Soluble Printing, Dipping, Dispensing Flip Chip Attach, Ball Attach, Solder Ball Attach Wire Bond BGA, Flip Chip BGA, Wire Bond CSP, Flip Chip CSP, Package on Package, SiP, Wafer CSP

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