Find Distributor

Products

TSF-6592LV

TSF-6592LV

Kester TSF-6592LV is a no-clean paste flux designed as a lead-free solution for an array of lead-free interconnect applications such as flip chip attach, sphere or ball attach, rework/repair of CSPs, BGAs, SMDs, or any lead-free soldering application that requires a very tacky flux. It has been optimized for consistent high speed printing applications. Share Find A Distributor To Buy
Halogen Content Description Part # Type Process Application Package
Contains Halogen TSF-6592LV 30g SYR 300303 No-Clean Printing, Dipping, Dispensing Flip Chip Attach, Ball Attach, Solder Ball Attach Wire Bond BGA, Flip Chip BGA, Wire Bond CSP, Flip Chip CSP, Flip Chip on Board, Traditional Leadframe, QFN, Package on Package, SiP, Wafer CSP
Contains Halogen TSF-6592LV 100g JAR 300304 No-Clean Printing, Dipping, Dispensing Flip Chip Attach, Ball Attach, Solder Ball Attach Wire Bond BGA, Flip Chip BGA, Wire Bond CSP, Flip Chip CSP, Flip Chip on Board, Traditional Leadframe, QFN, Package on Package, SiP, Wafer CSP
Contains Halogen TSF-6592LV 150g CRT 300305 No-Clean Printing, Dipping, Dispensing Flip Chip Attach, Ball Attach, Solder Ball Attach Wire Bond BGA, Flip Chip BGA, Wire Bond CSP, Flip Chip CSP, Flip Chip on Board, Traditional Leadframe, QFN, Package on Package, SiP, Wafer CSP

Process Compatible Products