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TSF-6521C

TSF-6521C

Kester TSF-6521C is a no-clean tacky soldering flux that exhibits a very high level of tack. TSF-6521C is designed for pick and place machines that are constantly moving the PCB at high speed doing component placement. The higher level of tack will help in limiting the amount of component displacement during component placement. TSF-6521C can be used in high speed dot dispensing for BGA/PGA sites or in a rework application for surface mount packages. TSF-6521C can also be printed utilizing standard stencil and printer parameters.

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Halogen Content Description Part # Type Application Package Notes
Contains Halogen TSF-6521C 30g SYR 300503 No-Clean Flip Chip Attach, Ball Attach, Solder Ball Attach Flip Chip BGA, Wire Bond BGA, Chip on Board, Traditional Leadframe, QFN Works Best with SnPb Systems
Contains Halogen TSF-6521C 150g CRT 300505 No-Clean Flip Chip Attach, Ball Attach, Solder Ball Attach Flip Chip BGA, Wire Bond BGA, Chip on Board, Traditional Leadframe, QFN Works Best with SnPb Systems
Contains Halogen TSF-6521C 100g JAR 300504 No-Clean Flip Chip Attach, Ball Attach, Solder Ball Attach Flip Chip BGA, Wire Bond BGA, Chip on Board, Traditional Leadframe, QFN Works Best with SnPb Systems

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