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TSF-6502JCR

Kester TSF-6502JCR is a no-clean tacky soldering flux formula that possesses a high activity level, allowing it to solder nickel surfaces. The robust wetting action of TSF-6502JCR will allow OSP treated copper, as well as heavily oxidized copper, surfaces to exhibit good soldering properties, even after 2 or 3 thermal cycles. Following reflow, TSF-6502JCR will leave aesthetically pleasing clear residues on the assembly. TSF-6502JCR is designed for a wide range of temperature and humidity conditions. Share Find A Distributor To Buy
Halogen Content Description Part # Type Process Application Package Notes
Contains Halogen TSF-6502JCR 30g SYR 300103 No-Clean Printing, Dipping, Dispensing Flip Chip Attach, Ball Attach, Solder Ball Attach Wire Bond BGA, Flip Chip BGA, Wire Bond CSP, Flip Chip CSP, Flip Chip on Board, Traditional Leadframe, QFN
Contains Halogen TSF-6502JCR 100 300104 No-Clean Printing, Dipping, Dispensing Flip Chip Attach, Ball Attach, Solder Ball Attach Wire Bond BGA, Flip Chip BGA, Wire Bond CSP, Flip Chip CSP, Flip Chip on Board, Traditional Leadframe, QFN Works Best with SnPb Solders
Contains Halogen TSF-6502JCR 150 CRT 300105 No-Clean Printing, Dipping, Dispensing Flip Chip Attach, Ball Attach, Solder Ball Attach Wire Bond BGA, Flip Chip BGA, Wire Bond CSP, Flip Chip CSP, Flip Chip on Board, Traditional Leadframe, QFN Works Best with SnPb Solders
Contains Halogen TSF-6502JCR 10g S 42500043 No-Clean Printing, Dipping, Dispensing Flip Chip Attach, Ball Attach, Solder Ball Attach Wire Bond BGA, Flip Chip BGA, Wire Bond CSP, Flip Chip CSP, Flip Chip on Board, Traditional Leadframe, QFN Works Best with SnPb Solders