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NXG1 Solder Paste

NXG1 Solder Paste

Kester NXG1 is a lead-free, no-clean solder paste designed to be used in air and nitrogen atmospheres and handle the thermal requirements of lead-free alloys. The paste flux system allows joint appearances that closely resemble that achieved with SnPb alloys. NXG1 is capable of stencil printing downtimes up to 120 minutes with an effective first print down to 0.4mm (16 mil) pitch QFPs. NXG1 also offers excellent cosmetic appearance in the reflowed solder joints with smooth, shiny solder and light colored residues. This paste also features the longest shelf life of any product in its class at 8 months. NXG1 is ANSI/J-SDTD-005 compliant. The flux as per IPC ANSI/J-STD-004B is classified ROL1. Share Find A Distributor To Buy
Alloy Powder Size Type Halogen Content Lead Content Description Part # Process
Sn96.5Ag3.0Cu0.5 3 No-Clean Contains Halogen Lead-Free NXG1 Sn96.5Ag3.0Cu0.5 T3 88.5% 750g DEK 7032050819 Screen/Stencil Printing
Sn99Ag0.3Cu0.7 4 No-Clean Contains Halogen Lead-Free NXG1 Sn99Ag0.3Cu0.7 T4 88.5% 1000g C 7032051812 Screen/Stencil Printing
Sn96.5Ag3.0Cu0.5 3 No-Clean Contains Halogen Lead-Free NXG1 Sn96.5Ag3.0Cu0.5 T3 88.5% 500g JAR 7032130810 Screen/Stencil Printing
Sn96.5Ag3.0Cu0.5 3 No-Clean Contains Halogen Lead-Free NXG1 Sn96.5Ag3.0Cu0.5 T3 88.5% 600g CRT 7032130811 Screen/Stencil Printing
Sn63Pb37 3 No-Clean Contains Halogen Leaded NXG1 Sn63Pb37 T3 89.55% 600g CRT 7032200511 Screen/Stencil Printing
Sn96.5Ag3Cu.5 3 No-Clean Contains Halogen Lead-Free NXG1 11.5% Sn96.5Ag3Cu.5 -T3-500g J 41500601 Screen/Stencil Printing
Sn96.5Ag3Cu.5 3 No-Clean Contains Halogen Lead-Free NXG1 11.5% Sn96.5Ag3Cu.5 25-45µ-600g C 41500603 Screen/Stencil Printing
Sn99Ag0.3Cu0.7 4 No-Clean Contains Halogen Lead-Free NXG1 11.5% Sn99Ag0.3Cu0.7 20-38µ-500g J 41500628 Screen/Stencil Printing

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