| Contains Halogen |
TSF-6592LV 30g SYR |
300303 |
No-Clean |
Printing, Dipping, Dispensing |
Flip Chip Attach, Ball Attach, Solder Ball Attach |
Wire Bond BGA, Flip Chip BGA, Wire Bond CSP, Flip Chip CSP, Flip Chip on Board, Traditional Leadframe, QFN, Package on Package, SiP, Wafer CSP |
| Contains Halogen |
TSF-6592LV 100g JAR |
300304 |
No-Clean |
Printing, Dipping, Dispensing |
Flip Chip Attach, Ball Attach, Solder Ball Attach |
Wire Bond BGA, Flip Chip BGA, Wire Bond CSP, Flip Chip CSP, Flip Chip on Board, Traditional Leadframe, QFN, Package on Package, SiP, Wafer CSP |
| Contains Halogen |
TSF-6592LV 150g CRT |
300305 |
No-Clean |
Printing, Dipping, Dispensing |
Flip Chip Attach, Ball Attach, Solder Ball Attach |
Wire Bond BGA, Flip Chip BGA, Wire Bond CSP, Flip Chip CSP, Flip Chip on Board, Traditional Leadframe, QFN, Package on Package, SiP, Wafer CSP |