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BAF-1488HF

BAF-1488HF

Kester BAF-1488HF is a water-soluble ball attach flux for use in assembling BGA packages. There are no intentionally added halogens, and BAF-1488HF has enough tack to prevent missing ball and ball misalignment defects.

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Halogen Content Description Part # Type Process Application Package Type
Halogen-Free BAF-1488HF 150g CRT 301905 Water-Soluble Printing Solder Ball Attach Wire Bond BGA, Flip Chip BGA, Wire Bond CSP, Flip Chip CSP