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EM828 Solder Paste

EM828 Solder Paste

Kester EM828 is a lead-free, water-soluble solder paste formulated specifically to reduce voiding behavior that is common with lead-free solder paste products.  EM828 represents a break-through in water-soluble solder paste technology with the combination of low voiding, excellent wetting behavior and ease of cleaning.  Additionally, EM828 is extremely stable in the stencil printing process, regardless of print speed, idle time and throughput.  EM828 provides tremendous wetting to a wide variety of board and component finishes in order to simplify your transition to lead-free processes.

Due to changes in REACH Regulations, this product is no longer sold into Europe or to European customers.

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Alloy Powder Size Type Halogen Content Lead Content Description Part # Process
Sn96.5Ag3.0Cu0.5 3 Water-Soluble Contains Halogen Lead-Free EM828 Sn96.5Ag3.0Cu0.5 T3 89.5% 500g JAR 7004030810 Screen/Stencil Printing
Sn96.5Ag3.0Cu0.5 4 Water-Soluble Contains Halogen Lead-Free EM828 Sn96.5Ag3.0Cu0.5 T4 89.5% 500g JAR 7004030910 Screen/Stencil Printing
Sn96.5Ag3Cu0.5 3 Water-Soluble Contains Halogen Lead-Free EM828 Sn96.5Ag3.0Cu0.5 T3 89.5% 500g CRT 7004030823 Screen/Stencil Printing
Sn96.5Ag3Cu0.5 3 Water-Soluble Contains Halogen Lead-Free EM828 10.5% Sn96.5Ag3Cu0.5 25-45µ 500g J 41500475 Screen/Stencil Printing
Sn96.5Ag3Cu0.5 4 Water-Soluble Contains Halogen Lead-Free EM828 Sn96.5Ag3.0Cu0.5 T4 89.5% 500g CRT 7004030923 Screen/Stencil Printing

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