Solder Spheres

Kester Solder Spheres are designed to support optimized ball-attach applications of ball grid array (BGA) and chip scale package (CSP) components. Ultra-Spheres® (Solder Spheres) are engineered to resist surface darkening induced by transit tumbling as well as ball placement equipment. This surface-darkening resistance eliminates vision systems' false "missing ball" error readings that may result in the unnecessary scrapping or rework of acceptable product.

Kester's precisely controlled alloying process yields distribution that exceeds industry expectations and eliminates unwanted sphere sizes. Kester's award winning quality practices and its use of the highest quality virgin metal demands homogeneity of the Solder Spheres composition.

Ultra-Spheres® are available in many solder alloys, including eutectic tin/lead and high lead typical for ceramic BGA packages as well as many of the industry demanded lead-free solder alloys. A wide range of sphere diameters for BGA and CSP ball attach applications are available from 0.012 to 0.035 inch (0.3 to 0.889 millimeter).

For more information on Kester's Solder Spheres for BGA or CSP ball-attach applications, services, distribution or research and development contact Kester global headquarters at (+1) 847.297.1600, by fax at (+1) 847.390.9338 or by e-mail at customerservice@kester.com

About Kester
With over 100 years of manufacturing experience, Kester is a leading global supplier of higher performance interconnecting materials and related services for the electronic and micro-component assembly markets. Kester superior products can be seen in its Lead-Free Solutions Materials, Solder Pastes, Bar Solders, Liquid Fluxes, Solid and Fluxed Cored Wires, Tacky Soldering Fluxes (TSF), Ultra-Spheres ®, Solderforms ®, SE-CURE ® Advanced Materials, Kester University (training and consultancy services) as well as a full spectrum of global customer technical support.

Throughout the world, Kester's products are known for their high quality and advanced technology. Kester's QS-9000, ISO-9001, and ISO 14001 certifications ensure Kester's partners of this dedication to quality and environmental responsibility.

Kester Today
Kester global headquarters operates from a facility located in the Chicago suburb of Itasca, Illinois with additional manufacturing facilities in Canada, Brazil, Mexico, Singapore, Germany, Japan, Taiwan, and Malaysia. Our worldwide manufacturing and technical capabilities provide the support required to serve major electronics manufacturing services providers and OEMs. Kester's global research and development strategy draws upon resources located in the U.S., Singapore, Germany, and Japan. Our R&D chemists are dedicated to advancing soldering technology to meet the needs of a constantly changing and advancing electronics marketplace. Whatever our customers' direction, Kester will be there to offer the complete product, process, and support solution.