Semiconductor Packaging Materials

Kester's, Semiconductor Packaging Materials for the microelectronic assembly and electronic packaging industry, are designed with the following technology drivers in mind such as size, weight, product density, and costs. Kester's comprehensive SE-CURE® line of wafer and substrate bumping pastes, ball/sphere attach fluxes (TSF), Ultra-Spheres® (solder spheres), reflow encapsulants (no flow underfills), capillary underfills, thermal interface material (TIM), and flip chip attach fluxes offer the right solution to your assembly challenges.

Kester with over a hundred years of experience in soldering technology understands the challenges associated with the use and development of semiconductor packaging materials.

Kester's advanced products are developed in concert with leading electronic component manufacturers like Intel who recognized the company with its prestigious SCQI quality award for five consecutive years.

For more information about Kester Semiconductor Packaging Materials, services, distribution or research and development contact Kester global headquarters at (+1) 847.297.1600, by fax at (+1) 847.390.9338 or by e-mail at customerservice@kester.com

About Kester
With over 100 years of manufacturing experience, Kester is a leading global supplier of higher performance interconnecting materials and related services for the electronic and micro-component assembly markets. Kester superior products can be seen in its Lead-Free Solutions Materials, Solder Pastes, Bar Solders, Liquid Fluxes, Solid and Fluxed Cored Wires, Tacky Soldering Fluxes (TSF), Ultra-Spheres ®, Solderforms ®, SE-CURE ® Advanced Materials, Kester University (training and consultancy services) as well as a full spectrum of global customer technical support.

Throughout the world, Kester's products are known for their high quality and advanced technology. Kester's QS-9000, ISO-9001, and ISO 14001 certifications ensure Kester's partners of this dedication to quality and environmental responsibility.

Kester Today
Kester global headquarters operates from a facility located in the Chicago suburb of Itasca, Illinois with additional manufacturing facilities in Canada, Brazil, Mexico, Singapore, Germany, Japan, Taiwan, and Malaysia. Our worldwide manufacturing and technical capabilities provide the support required to serve major electronics manufacturing services providers and OEMs. Kester's global research and development strategy draws upon resources located in the U.S., Singapore, Germany, and Japan. Our R&D chemists are dedicated to advancing soldering technology to meet the needs of a constantly changing and advancing electronics marketplace. Whatever our customers' direction, Kester will be there to offer the complete product, process, and support solution.