No Flow Underfill

Kester's No Flow Underfills(also known as SE-CURE® single pass reflow encapsulants) are single component liquid epoxy-based flux and underfill encapsulants developed for eutectic tin-lead and lead-free flip chip attach applications on flexible and rigid substrates. These No Flow Underfills are designed to enhance solder joint reliability during temperature cycling of chip scale packages (CSP's) and flip chip devices. Single pass reflow encapsulants eliminate costly process time associated with traditional underfill process methods through an innovative compression flow technique. Kester's No Flow Underfill allows for increased environmental and process robustness. This robustness becomes useful in high humidity and temperature environments where the dwell times between material dispense and chip placement becomes critical.

Benifits
The unique advantage of Kester single pass reflow encapsulants is its concurrent processing of normal surface mount component packages with flip chips in a single reflow profile. The result is the optimization of the production environment by reducing the number of processing steps required for assembly. Utilizing compression flow over traditional capillary flow type underfills will further reduce processing time. Kester single pass reflow encapsulants are also independent of gap height variations. These materials utilize a unique system that allows for the material to maintain consistent dispense characteristics over extended dwell times between material dispense and chip placement allowing for greater process robustness in high volume production.

Kester's No Flow Underfills are helping customers in a wide array of flip chip attach applications with unique interconnecting solutions. Our award-winning materials will produce improved results in your most challenging applications. Regardless of your location or requirements, let Kester tailor a solution that's right for your application.

For more information about Kester services, distribution or research and development contact Kester global headquarters at (+1) 847.297.1600, by fax at (+1) 847.390.9338 or by e-mail at customerservice@kester.com.

About Kester
With over 100 years of manufacturing experience, Kester is a leading global supplier of higher performance interconnecting materials and related services for the electronic and micro-component assembly markets. Kester superior products can be seen in its Lead-Free Solutions Materials, Solder Pastes, Bar Solders, Liquid Fluxes, Solid and Fluxed Cored Wires, Tacky Soldering Fluxes (TSF), Ultra-Spheres ®, Solderforms ®, SE-CURE ® Advanced Materials, Kester University (training and consultancy services) as well as a full spectrum of global customer technical support.

Throughout the world, Kester's products are known for their high quality and advanced technology. Kester's QS-9000, ISO-9001, and ISO 14001 certifications ensure Kester's partners of this dedication to quality and environmental responsibility.

Kester Today
Kester global headquarters operates from a facility located in the Chicago suburb of Itasca, Illinois with additional manufacturing facilities in Canada, Brazil, Mexico, Singapore, Germany, Japan, Taiwan, and Malaysia. Our worldwide manufacturing and technical capabilities provide the support required to serve major electronics manufacturing services providers and OEMs. Kester's global research and development strategy draws upon resources located in the U.S., Singapore, Germany, and Japan. Our R&D chemists are dedicated to advancing soldering technology to meet the needs of a constantly changing and advancing electronics marketplace. Whatever our customers' direction, Kester will be there to offer the complete product, process, and support solution.