Epoxy Flux

Kester's Epoxy Fluxes are a No-Clean Polymer Flux (NPF) representing an innovative approach for lead-free flip-chip attachment for high-performance electronic packages. Kester's Epoxy Fluxes are a multi-functional material that is a drop-in replacement for water washable or no clean Tacky Soldering Fluxes (TSF). These NPF's are intended for use with a thin film applicator (rotating drum or slide). The residues resulting from the attach process form a polymer film at the base of the soldered joint and enhance the mechanical bond between underfill and substrate. These residues can also crosslink with high-performance capillary underfill systems.

Benefits
Kester Epoxy Fluxes are intended to enhance process yield and reliability for high-end flip-chip-in-package applications such as ASICs, DSP chips and high-power microprocessors. These Epoxy Fluxes provide many unique advantages to the user; it is the first flux to be designed in conjunction with leading underfill materials, not designed separately with material interactions as an afterthought.

Kester Epoxy Fluxes are also designed to increase the mechanical integrity of the flux/underfill system while eliminating the cleaning process associated with water-washable TSF. Kester's Epoxy Fluxes facilitates soldering to difficult to wet substrate finishes as well as enhancing the flow of capillary underfill materials that help to eliminate entrapment voids associated with interrupted flow. Kester Epoxy Fluxes provide exceptional reliability for large, high I/O count die in packages requiring the highest reliability levels when used with compatible underfill systems.

For more information about Kester Epoxy Flux, services, distribution or research and development contact Kester global headquarters at (+1) 847.297.1600, by fax at (+1) 847.390.9338 or by e-mail at customerservice@kester.com.

About Kester
With over 100 years of manufacturing experience, Kester is a leading global supplier of higher performance interconnecting materials and related services for the electronic and micro-component assembly markets. Kester superior products can be seen in its Lead-Free Solutions Materials, Solder Pastes, Bar Solders, Liquid Fluxes, Solid and Fluxed Cored Wires, Tacky Soldering Fluxes (TSF), Ultra-Spheres ®, Solderforms ®, SE-CURE ® Advanced Materials, Kester University (training and consultancy services) as well as a full spectrum of global customer technical support.

Throughout the world, Kester's products are known for their high quality and advanced technology. Kester's QS-9000, ISO-9001, and ISO 14001 certifications ensure Kester's partners of this dedication to quality and environmental responsibility.

Kester Today
Kester global headquarters operates from a facility located in the Chicago suburb of Itasca, Illinois with additional manufacturing facilities in Canada, Brazil, Mexico, Singapore, Germany, Japan, Taiwan, and Malaysia. Our worldwide manufacturing and technical capabilities provide the support required to serve major electronics manufacturing services providers and OEMs. Kester's global research and development strategy draws upon resources located in the U.S., Singapore, Germany, and Japan. Our R&D chemists are dedicated to advancing soldering technology to meet the needs of a constantly changing and advancing electronics marketplace. Whatever our customers' direction, Kester will be there to offer the complete product, process, and support solution.