Ball Chip Attach Flux
Kester's Ball Chip Attach Fluxes (no-clean and water-soluble) are designed as a Lead-Free Solution for an array of Lead-Free interconnect applications such as flip chip attach, sphere or ball attach, rework/repair of CSPs, BGAs, SMDs, or any Lead-Free soldering application that requires a very tacky flux.
Kester's hundred plus years of experience in soldering technology understands the challenge associated with developing Ball Chip Attach Flux solder tailored to your specific needs and requirements. With Kester ball chip attach solder, process engineers will have access to the most complete line of standard and unique die attach materials backed by Kester's unsurpassed experience in soldering technology.
Water-Soluble Paste Flux Performance Characteristics:
- No crystallization of the paste flux to interfere with maintaining high assembly yields
- Compatible with Lead Free alloys such as SnAg, SnCu, SnAgCu, SnAgBi
- Reflow-able with peak temperatures up to 270 °C
- Bright shiny soldered joints
- Easily removed residues
- Aggressive flux on various substrates such as OSP-Cu, Immersion finishes and ENIG
- High tack to minimize skewing of components
- Stencil Life of 8+ hours (process dependent)
- Can reflow in air or nitrogen environments
- Classified as ORH0 per J-STD-004
No-Clean Paste Flux Performance Characteristics:
- Compatible with Lead Free alloys such as SnAg, SnCu, SnAgCu, SnAgBi
- Reflow-able with peak temperatures up to 270°C
- Reflow-able in air and nitrogen
- Bright shiny soldered joints with clear residues
- Aggressive flux on various substrates such as OSP-Cu, Immersion finishes and ENIG
- Clear non-tacky residues
- High tack to minimize skewing of components
- Low voiding
- Stencil Life of 8+ hours (process dependent)
- Classified as ROL0 per J-STD-004
For more information about Kester Ball Chip Attach Fluxes, services, distribution or research and development contact Kester global headquarters at (+1) 847.297.1600, by fax at (+1) 847.390.9338 or by e-mail at customerservice@kester.com
About Kester
With over 100 years of manufacturing experience, Kester is a leading global supplier of higher performance interconnecting materials and related services for the electronic and micro-component assembly markets. Kester superior products can be seen in its Lead-Free Solutions Materials, Solder Pastes, Bar Solders, Liquid Fluxes, Solid and Fluxed Cored Wires, Tacky Soldering Fluxes (TSF), Ultra-Spheres ®, Solderforms ®, SE-CURE ® Advanced Materials, Kester University (training and consultancy services) as well as a full spectrum of global customer technical support.
Throughout the world, Kester's products are known for their high quality and advanced technology. Kester's QS-9000, ISO-9001, and ISO 14001 certifications ensure Kester's partners of this dedication to quality and environmental responsibility.
Kester Today
Kester global headquarters operates from a facility located in the Chicago suburb of Itasca, Illinois with additional manufacturing facilities in Canada, Brazil, Mexico, Singapore, Germany, Japan, Taiwan, and Malaysia. Our worldwide manufacturing and technical capabilities provide the support required to serve major electronics manufacturing services providers and OEMs.
Kester's global research and development strategy draws upon resources located in the U.S., Singapore, Germany, and Japan. Our R&D chemists are dedicated to advancing soldering technology to meet the needs of a constantly changing and advancing electronics marketplace. Whatever our customers' direction, Kester will be there to offer the complete product, process, and support solution.
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