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Kester to Participate in Numerous Activities During APEX 2007
Kester will present its latest lead-free soldering products and award winning K100LD solder for lead-free wave, selective and hand-soldering applications.
Date: 6/11/2007 11:22:34 AM
Visit Kester’s Lead-Free Information Center at APEX 2007
Kester will provide lead-free resources, technologies and products in at the upcoming APEX 2007 exhibition and conference in Los Angeles.
Date: 6/11/2007 11:20:37 AM
Kester Launches New Ultrapure® K100LD -Lead-Free Solder with Lowest Copper Dissolution
Kester announces UltraPure® K100LD, a lead-free bar solder alloy for the electronics industry.
Date: 6/11/2007 11:16:38 AM
Kester to Present Paper at International Conference on Soldering and Reliability
Kester announces that Peter Biocca will present a technical paper at the upcoming International Conference on Soldering and Reliability in Toronto, Ontario, Canada.
Date: 6/11/2007 11:10:20 AM
Kester to Showcase K100LD at NEPCON China/EMT China 2007
Kester will showcase its low-cost Ultrapure K100LD lead-free bar solder alloy
Date: 6/11/2007 11:07:43 AM
Kester to Showcase EM918AP Solder Paste at NEPCON China/EMT China 2007
Kester will display its EM918AP lead-free, no-clean solder paste at the upcoming NEPCON China/EMT China 2007 exhibition and conference.
Date: 6/11/2007 11:03:34 AM
Kester Wins A VISION Award for Ultrapure® K100LD
Kester announces that it has been awarded a SMT VISION Award in the category of Environmentally Friendly Products/Services for its innovative UltraPure® K100LD.
Date: 6/11/2007 11:01:08 AM
Peter Biocca to Present at Advanced Electronics and Manufacturing Show 2006
Kester proudly announces that Peter Biocca, will present during the Electronic Representatives Association (ERA)’s Advanced Electronics and Manufacturing Show 2006.
Date: 6/11/2007 10:54:54 AM
Kester to Showcase InnovaBond Solutions at PCIM 2006
Kester announces that it will display InnovaBond products at the upcoming PCIM exhibition, taking place during SMT/Hybrid/Packaging 2006 exhibition and conference.
Date: 6/11/2007 10:49:33 AM
Visit Kester’s Lead-Free Information Center at GlobalTronics 2006
Kester will provide lead-free resources, technologies and products in booth F28 at the upcoming GlobalTronics exhibition, scheduled to take place October 10-13, in Suntec Singapore.
Date: 6/11/2007 10:45:42 AM
Kester’s Mona Chay to Present at DISKON Asia Pacific 2006
Kester announces that Mona Chay, market development manager with Kester Asia Pacific, will present during DISKCON Asia Pacific 2006, scheduled to take place March 8 to 9, 2006, in Singapore.
Date: 6/11/2007 10:40:26 AM
Kester to Present at SWEPEX 2006
Kester announces that Senior Market Development Engineer Peter Biocca will participate in the SMTA technical presentation co-located with the Southwest Electronics Production Exposition (SWEPEX).
Date: 6/11/2007 10:37:56 AM
KESTER WINS VISION AWARD FOR ULTRAPURE K100LD
Kester has been awarded a SMT VISION Award in the category of Environmentally Friendly Products/Services for UltraPure® K100LD, a lead-free bar solder alloy.
Date: 2/1/2007 6:58:54 AM
KESTER EXHIBITS AT MEXITRONICA 2006
Kester will provide lead-free resources, technologies and products in booth 616 at the upcoming Mexitrónica conference and exhibition on October 10-12, 2006 in Guadalajara, Jalisco, Mexico.
Date: 10/27/2006 3:22:02 PM
KESTER WINS 2006 GLOBAL TECHNOLOGY AWARD
Kester announces that it has been awarded a Global Technology Award in the category of Environmentally Friendly Products/Services for its innovative UltraPure® lead-free K100LD alloy.
Date: 10/27/2006 3:18:55 PM
VISIT KESTER AT ATEXPO 2006
Kester will provide lead-free resources, technologies and products in booth 5236 at the upcoming Assembly Technology Expo (ATExpo), scheduled to take place September 26-28.
Date: 10/27/2006 3:12:37 PM
KESTER LAUNCHES ULTRAPURE K100LD LEAD-FREE ALLOY
Kester announces UltraPure® K100LD, a lead-free bar solder alloy for the electronics industry. K100LD is a patent-pending, low-cost alternative to traditional lead-free alloys.
Date: 10/27/2006 3:08:49 PM
NEW MARKETING AGREEMENT FOR ULTRA-SPHERES DISTRIBUTION
Kester announces that it has finalized a marketing and distribution agreement with EasySpheres to inventory and sell Kester’s full product offering of Ultra-Spheres® and TSF interconnect fluxes.
Date: 10/27/2006 3:00:28 PM
KESTER PRESENTS AT ESCC 2006
Kester announces that Surge Tuerlings will present at ESCC 2006, scheduled to take place October 4 to 5, 2006, in Cologne.
Date: 10/27/2006 2:54:45 PM
KESTER PRESENTS AT IPC WORKS 2006
Kester announces that Peter Biocca will present at IPCWorks 2006, scheduled to take place September 10 to 14, 2006, at the American Airlines Training and Conference Center in Fort Worth, Texas.
Date: 10/27/2006 2:36:36 PM
KESTER SHOWCASES ULTRAPURE K100LD LEAD-FREE SOLDER AT NEPCON SOUTH CHINA 2006
Kester exhibits UltraPure® K100LD in booth 2A41 at NEPCON South China exhibition on August 29 through September 1, 2006.
Date: 8/3/2006 9:36:04 AM
KESTER ACQUIRED BY IILINOIS TOOL WORKS INC.
Kester announces that it has been bought by Illinois Tool Works Inc. (NYSE: ITW) of Glenview, Ill.
Date: 8/1/2006 10:10:46 AM
KESTER AND VITRONICS SOLTEC COMPLETE SUCCESSFUL LEAD-FREE SEMINARS
Kester and Vitronics Soltec successfully hosted a series of lead-free seminars throughout June 2006 in the Los Angeles, Chicago and Boston area
Date: 8/1/2006 9:40:25 AM
KESTER AND VITRONICS SOLTEC TEAM TO HOST A SERIES OF LEAD-FREE RoHS ASSEMBLY SEMINARS
Kester and Vitronics Soltec announce that they will host lead-free RoHS seminars in three different locations throughout the month of June 2006.
Date: 7/19/2006 11:13:13 AM
KESTER TO INTRODUCE NEW PRODUCTS AT SEMICON WEST 2006
Kester introduces three new Lead-Free semiconductor packaging materials at SEMICON West 2006 trade show.
Date: 7/19/2006 10:26:19 AM
VISIT KESTER'S LEAD-FREE RoHS INFORMATION CENTER AT NEPCON CHINA 2006
Kester will provide lead-free resources, technologies and products at the NEPCON China/EMT China 2006 trade show in Shanghai, China.
Date: 7/19/2006 10:19:58 AM
KESTER'S ENVIROMARK 907 NO-CLEAN LEAD-FREE SODLER PASTE WINS INNOVATION AWARD
Kester awarded an Innovation Award in the category of Environmentally Friendly Products for its EnviroMark 907 (EM907), a no-clean, lead-free solder paste.
Date: 7/19/2006 10:15:24 AM
KESTER TO PARTICIPATE IN UPCOMING INTERNATIONAL CONFERENCE ON LEAD-FREE SOLDERING
Kester's Peter Biocca will present at the International Conference on Lead-free Soldering in Toronto, Ontario, Canada.
Date: 7/19/2006 10:08:28 AM
KESTER TO PARTICIPATE IN LEAD-FREE CONFERENCE AT NEPCON CHINA 2006
Kester will participate in the one-day Lead-free Conference scheduled to take place on Monday, April 3 during NEPCON China.
Date: 7/19/2006 10:00:57 AM
KESTER WINS A VISION AWARD FOR ENVIROMARK 907 NO-CLEAN LEAD-FREE SOLDER PASTE
Kester awarded a coveted SMT VISION Award in the category of Solder Materials for EnviroMark 907 No-Clean Lead-Free Solder Mark.
Date: 7/19/2006 9:46:32 AM
KESTER TO DISPLAY EVIROMARK 907 NO-CLEAN LEAD-FREE SOLDER PASTE AT APEX 2006
Kester announces that it will showcase EnviroMark 907 (EM907) — a new no-clean, lead-free solder paste to the electronics industry at the APEX 2006 trade show
Date: 7/19/2006 9:44:43 AM
VISIT KESTER'S LEAD-FREE RoHS INFORMATION CENTER AT APEX 2006
Kester will provide numerous lead-free resources, technologies and products in booth 1085 at the upcoming APEX trade show.
Date: 7/19/2006 9:38:30 AM
KESTER ULTRAPURE® LEAD-FREE BAR - A LOW COST ALTERNATIVE TO TRADITIONAL LEAD-FREE ALLOYS
Kester announces that it will premier Ultrapure® K100, a lead-free bar solder alloy to the electronics industry at the upcoming Productronica trade show.
Date: 7/19/2006 9:33:02 AM
KESTER'S LEAD-FREE CONNECTIONS NEWSLETTER CELEBRATES ONE-YEAR ANNIVERSARY
Kester proudly announces that its quarterly newsletter designed to ease the transition to lead-free for both customers and the industry will celebrate its one-year anniversary with the July issue.
Date: 7/19/2006 9:17:38 AM
KESTER ANNOUNCES LEAD-FREE SOLDER PASTE PACKAGING AND TRIANGULAR SOLDER BARS
Kester is being proactive and anticipating engineers’ concerns with confusion on the production lines about mixing lead and lead-free materials.
Date: 7/19/2006 8:57:35 AM
KESTER TO HOST LEAD-FREE RoHS ASSEMBLY SEMINAR IN CHICAGO
Kester announces that it will hold seminars throughout 2005 titled, “Project 2005: Achieving Lead-free RoHS Assembly” in North America.
Date: 7/19/2006 8:39:40 AM
KESTER, VITRONICS SOLTEC HOSTS LEAD-FREE RoHS ASSEMBLY SEMINARS IN MANAUS and SAN PAULO BRAZIL
Kester announces that it will hold seminars throughout 2005 titled, “Project 2005: Achieving Lead-free RoHS Assembly.”
Date: 7/19/2006 8:19:08 AM
KESTER HOST LEAD-FREE RoHS ASSEMBLY CLINIC DURING APEX
Kester will hold the Lead-free RoHS Clinic throughout the upcoming APEX trade show with the goal of assisting industry companies to transition reliably to lead-free and RoHS compliancy.
Date: 7/19/2006 8:06:17 AM
ENVIROMARK 909 LEAD-FREE NO-CLEAN PASTE PREMIERS AT APEX
Kester announces that it will showcase EnviroMark 909 (EM909) — a new lead-free, no-clean solder paste to the electronics industry in booth 957 during the APEX trade show.
Date: 7/19/2006 8:00:09 AM
KESTER AWARDED PATENT FOR REFLOW ENCAPSULANT TECHNOLOGY
Kester proudly announces that it has been awarded a patent for its Reflow Encapsulant technology including material and method of use.
Date: 7/18/2006 4:03:23 PM
FLIP CHIP INT'L & KESTER ANNOUNCE JOINT COLLABORATION
FlipChip International (FCI) and Kester announced a joint collaboration agreement on FlipChip’s low void wafer bumping paste technology.
Date: 7/18/2006 3:41:18 PM
KESTER EXPANDS INTO MEXICO
Kester has announced that it will open a facility in Nogales, Mexico to meet unprecedented industry demand for its interconnect solder materials.
Date: 10/12/2004 7:41:46 AM
KESTER INTRODUCES EM907 NO-CLEAN LEAD-FREE SOLDER PASTE
Kester announces EnviroMark 907 (EM907) — a new no-clean, lead-free solder paste to the electronics industry.
Date: 10/12/2004 7:39:11 AM
KESTER RECEIVES VISION AWARD FOR SE-CURE 9111 SINGLE PASS REFLOW ENCAPSULANT
Kester announces that it has been awarded a coveted SMT VISION Award in the category of Adhesives/Coatings/Encapsulants for SE-CURE 9111, a single pass reflow encapsulant.
Date: 4/12/2004 7:42:22 AM
KESTER APPOINTS CABIOTEC AS DISTRIBUTOR FOR ITALY
Kester announces that Cabiotec S.R.L. has been appointed as distributor serving Italy.
Date: 4/12/2004 7:15:04 AM
KESTER’S MUNIE CHOSEN AS TECHNICAL CONFERENCE DIRECTOR FOR ECWC 10
Dr. Gregory Munie of Kester has been chosen to act as the Technical Conference Director for Electronic Circuits World Convention 10.
Date: 4/12/2004 7:10:43 AM
KESTER RECEIVES INTEL’S PRESTIGIOUS SUPPLIER CONTINUOUS QUALTIY IMPROVEMENT AWARD
Kester was named a recipient of Intel Corporation’s prestigious 2003 Supplier Continuous Quality Improvement (SCQI) award, Intel’s highest honor for its suppliers, for outstanding commitment to....
Date: 4/12/2004 6:57:19 AM
AMERICAN CAPITAL INVEST INTO KESTER
Kester announces that its business unit of Northrop Grumman Corp. (NYSE: NOC) has been sold to American Capital Strategies Ltd. (Nasdaq: ACAS) for an undisclosed amount.
Date: 4/12/2004 6:41:43 AM
KESTER ANNOUNCES LEAD-FREE R520A WATER-SOLUBLE PASTE, FLUX ENHANCED SYSTEM FOR HIGHER TEMPERATURES
Northrop Grumman Corporation announces Kester now offers the R520A lead-free solder paste, a new water-soluble paste specifically designed for lead-free assembly.
Date: 12/4/2003 12:36:29 PM
KESTER LEAD-FREE SOLUTIONS ENABLES TECHNOLOGIES FOR LEAD-FREE SMT, WAVE SOLDERING AND REWORK
Kester announces a complete line of soldering products for lead-free assembly to its global customer base, helping them and the industry make lead-free a reality today.
Date: 12/4/2003 12:05:47 PM
KESTER PARTICIPATES IN UPCOMING SMTA WEBCAST
Northrop Grumman Corporation announces Kester will participate in the first SMTA Online Symposium on December 1 at 12 p.m., along with other...
Date: 12/4/2003 11:06:46 AM
KESTER’S SERGE TUERLINGS TO SPEAK AT INTERNATIONAL CONFERENCE ON LEAD-FREE ELECTRONICS
Northrop Grumman Corporation announces that Serge Tuerlings, market development manager of Kester Europe, will present a paper at the upcoming conference on lead-free electronics.
Date: 12/4/2003 10:43:15 AM
NORTHROP GRUMMAN ANNOUNCES 979 - VOC-FREE NO-CLEAN LIQUID FLUX FOR RELIABLE LEAD-FREE WAVE SOLDERING
Northrop Grumman Corporation announces Kester has introduced 979 VOC-Free no-clean liquid flux for lead-free wave assembly.
Date: 12/2/2003 1:08:17 PM
NORTHROP GRUMMAN INTRODUCES SOLDER PASTE FOR AUTOMOTIVE ELECTRONICS MARKET
Northrop Grumman Corporation announces the introduction of FL250D, a no-clean solder paste by Kester. FL250D is designed to meet or exceed all requirements of the automotive industry’s electronics...
Date: 12/1/2003 10:09:20 AM
NORTHROP GRUMMAN INTRODUCES INNOVATIVE SOLDER SPHERES FOR BGA AND CSP COMPONENTS ASSEMBLY
Northrop Grumman Corporation announces Kester® has introduced Ultra-Spheres®. The solder spheres support optimized ball-attach applications of ball grid array (BGA) and chip scale package...
Date: 12/1/2003 9:39:11 AM
NORTHROP GRUMMAN INTRODUCES CAPILLARY UNDERFILL TO SPEED FLIP CHIP DEVICE ASSEMBLY
Northrop Grumman Corporation announces Kester® has introduced SE-CURE® 9208 capillary underfill targeted for the fast throughput assembly of flip chip devices on rigid and flexible substrates.
Date: 12/1/2003 9:29:36 AM
NORTHROP GRUMMAN ANNOUNCES WATER SOLUBLE, WAFER BUMPING SOLDER PASTE
Northrop Grumman Corporation announces Kester® has introduced SE-CURE® 7101, a solder paste targeted at users invested in the lower cost paste bumping operations of wafers and substrates.
Date: 12/1/2003 9:13:48 AM
NORTHROP GRUMMAN INTRODUCES ENVIRONMENTALLY FRIENDLY, LEAD-FREE, NO-CLEAN SOLDER PASTE
Northrop Grumman Corporation announces Kester® has introduced R905, a new lead-free, no-clean solder paste.
Date: 12/1/2003 8:43:10 AM
NORTHROP GRUMMAN RECEIVES INTEL'S PRESTIGIOUS SUPPLIER CONTINUOUS QUALITY IMPROVEMENT AWARD
Northrop Grumman Corporation announces Kester has received Intel Corporation's prestigious 2002 Supplier Continuous Quality Improvement (SCQI) award for an unprecedented fourth consecutive year.
Date: 12/1/2003 8:34:18 AM
NORTHROP GRUMMAN INTRODUCES KESTER'S PUREMARK 202 HIGHLY VERSATILE NO-CLEAN PASTE
Northrop Grumman Corporation announces the introduction of PureMark 202 no-clean solder paste by Kester. PureMark 202 is the first all-purpose, no-clean solder paste with in-circuit-test pin...
Date: 12/1/2003 8:14:59 AM
NORTHROP GRUMMAN INTRODUCES HIGHLY CONSISTENT WATER-SOLUBLE SOLDER PASTE
Northrop Grumman Corporation announces the introduction of HydroMark 531 water-soluble solder paste by Kester.
Date: 12/1/2003 8:07:22 AM
NORTHROP GRUMMAN INTRODUCES SINGLE-PASS REFLOW ENCAPSULANT
Northrop Grumman Corporation announces Kester® has introduced SE-CURE® 9126 single-pass reflow encapsulant. The product is intended for mounting eutectic tin/lead flip chip and fine-pitch chip-scale..
Date: 10/27/2003 11:55:27 AM
NORTHROP GRUMMAN INTRODUCES SINGLE-PASS REFLOW ENCAPSULANT FOR FLIP CHIP-ON-FLEX APPLICATIONS
Northrop Grumman Corporation announces Kester® has introduced the SE-CURE® 9110 series of Reflow Encapsulant (RE) materials intended for flip chip-on-flex applications.
Date: 10/27/2003 11:33:10 AM