Solderpaste and Flux Solutions
For Lead-Free Processes

Kester products for lead-free assembly are designed to enhance the wetting properties of lead-free alloys. The chemistries are more thermally stable and offer the engineer the maximum operating window for his process. Optimized flux chemistries results in solid reliability for the process and the assembly; this preserves production yields normally accustomed with tin-lead processes.

All products are available in industry standard packages.

For Wave Soldering Operations

• Alloys
  • Sn99.3Cu0.7
  • Sn96.5Ag3.5
  • Sn96.5Ag3.0Cu0.5
• Liquid Fluxes
  • No-Clean VOC Free – 979
  • No-Clean - 959T
  • Water Soluble VOC Free- 2220-VF

For Surface Mount Soldering

• Alloys
  • Sn96.5Ag3.5
  • Sn96.5Ag3.0Cu0.5
• Fluxes
  • No-Clean - EnviroMark 907
  • Water Soluble - R520A

For Dispensing Solder Paste Operations

• Alloys
  • Sn96.5Ag3.5
  • Sn96.5Ag3.0Cu0.5
• Fluxes
  • No-Clean – R276
  • Water Soluble - R505

For Hand Soldering Operations

• Alloys
  • Sn96.5Ag3.5
  • Sn96.5Ag3.0Cu0.5
  • Sn99.3Cu0.7
• Fluxes
  • No-Clean -275
  • Water Soluble -  331
  • Rosin - 48
• Flux Pens
  • No-Clean -952D-6
  • Water Soluble -  2331-ZX
  • Rosin -186

For Rework and BGA attachment

• Tacky Soldering Fluxes (TSF's)
  • No-clean - TSF 6592
  • Water Soluble - TSF 6850