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EM907
EnviroMarkTM 907 is a lead-free, air and nitrogen
reflowable no-clean solder paste specifically
designed for the thermal requirements of lead free
alloys, including the Sn96.5Ag3.0Cu0.5 alloy.
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EP256
Easy Profile® 256 is a no-clean, air or nitrogen reflowable, solder paste specifically designed for maximum robustness in reflow profiling and stencil printing.
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EP-256HA
Easy Profile® 256HA is a no-clean, air or nitrogen
reflowable solder paste specifically designed to
provide maximum print characteristics and
solderability. EP256HA has been designed for
applications that require the ultimate activity with
respect to difficult to solder to components and
board surface metallizations.
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NXG1
Kester NXG1 is the preferred no-clean solder paste for lead-free applications.
Kester NXG1 is a lead-free, air and nitrogen
reflowable no-clean solder paste specifically
designed for the thermal requirements of lead free
alloys, including the Sn96.5Ag3.0Cu0.5 alloy. The
paste flux system allows joint appearances that
closely resemble that achieved with SnPb alloys.
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