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TSF-6502
TSF-6502 is the recommended Tacky Soldering Flux for Tin-Lead Applications.
Kester TSF-6502 is a no-clean tacky soldering flux
formula that possesses a high activity level, allowing
it to solder nickel surfaces. The robust wetting
action of TSF-6502 will allow OSP treated copper,
as well as heavily oxidized copper, surfaces to
exhibit good soldering properties, even after 2 or 3
thermal cycles.
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TSF-6592LV
TSF-6592LV is the recommendedTacky Soldering Flux for Lead-Free Alloys.
Kester TSF-6592LV is a No Clean Paste Flux
designed as a Lead Free Solution for an array of
Lead Free interconnect applications such as flip
chip attach, sphere or ball attach, rework/repair of
CSPs, BGAs, SMDs, or any Lead Free soldering
application that requires a very tacky flux.
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TSF-6852
TSF-6852 is the recommended Sphere Attach tacky flux for both Tin-lead and Lead-Free Alloys.
Kester TSF-6852 is a synthetic water soluble tacky
soldering flux. The synthetic ingredients eliminate
naturally occurring raw materials typically found in
fluxes. This maximizes lot-to-lot consistency.
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TSF-8808
Kester TSF-8808 is a synthetic water soluble tacky soldering flux formula
TSF-8808 has no intentionally added halogens. It is specifically formulated to meet the IEC 61249-2-21 definition for halide free materials.
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