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TSF-6502
Kester TSF-6502 is a no-clean tacky soldering flux
formula that possesses a high activity level, allowing
it to solder nickel surfaces.
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TSF-6522
Kester TSF-6522 is a no-clean tacky soldering flux
formula designed to be used with a rotating disc, a
doctor blade, or a drum fluxer. Kester TSF-6522
can also be used in dot dispensing for BGA/PGA
sites or in a rework application for surface mount
packages.
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TSF-6522RH
Kester’s TSF-6522RH is a rosin based no-clean
tacky soldering flux formula designed to be
compliant with IEC 61249-2-21 definition for halide
free materials.
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TSF-6592LV
Recommended for lead-free applications.
Kester TSF-6592LV is a No Clean Paste Flux
designed as a Lead Free Solution for an array of
Lead Free interconnect applications such as flip
chip attach, sphere or ball attach, rework/repair of
CSPs, BGAs, SMDs, or any Lead Free soldering
application that requires a very tacky flux.
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TSF-6852
Recommended for both Tin-Lead and Lead-Free alloys.
Kester TSF-6852 is a synthetic water soluble tacky
soldering flux. The synthetic ingredients eliminate
naturally occurring raw materials typically found in
fluxes.
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TSF-8808
Kester TSF-8808 is a synthetic water soluble tacky soldering flux formula.
TSF-8808 has no intentionally added halogens. It is specifically formulated to meet the IEC 61249-2-21 definition for halide free materials.
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